第二届伴侣密码国际研讨会，2023 年。

{"title":"第二届伴侣密码国际研讨会，2023 年。","authors":"Johannes Buchner , Milad J. Alasady , Sarah J. Backe , Brian S.J. Blagg , Richard L. Carpenter , Giorgio Colombo , Ioannis Gelis , Daniel T. Gewirth , Lila M. Gierasch , Walid A. Houry , Jill L. Johnson , Byoung Heon Kang , Aimee W. Kao , Paul LaPointe , Seema Mattoo , Amie J. McClellan , Leonard M. Neckers , Chrisostomos Prodromou , Andrea Rasola , Rebecca A. Sager , Mark R. Woodford","doi":"10.1016/j.cstres.2024.01.003","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":null,"pages":null},"PeriodicalIF":4.3000,"publicationDate":"2024-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.sciencedirect.com/science/article/pii/S1355814524000439/pdfft?md5=50743cea79ad1daf680c078231bdfc5d&pid=1-s2.0-S1355814524000439-main.pdf","citationCount":"0","resultStr":"{\"title\":\"Second international symposium on the chaperone code, 2023\",\"authors\":\"Johannes Buchner , Milad J. Alasady , Sarah J. Backe , Brian S.J. Blagg , Richard L. Carpenter , Giorgio Colombo , Ioannis Gelis , Daniel T. Gewirth , Lila M. Gierasch , Walid A. Houry , Jill L. Johnson , Byoung Heon Kang , Aimee W. Kao , Paul LaPointe , Seema Mattoo , Amie J. McClellan , Leonard M. Neckers , Chrisostomos Prodromou , Andrea Rasola , Rebecca A. Sager , Mark R. Woodford\",\"doi\":\"10.1016/j.cstres.2024.01.003\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":3,\"journal\":{\"name\":\"ACS Applied Electronic Materials\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.3000,\"publicationDate\":\"2024-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.sciencedirect.com/science/article/pii/S1355814524000439/pdfft?md5=50743cea79ad1daf680c078231bdfc5d&pid=1-s2.0-S1355814524000439-main.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Applied Electronic Materials\",\"FirstCategoryId\":\"99\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1355814524000439\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"99","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1355814524000439","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}