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引用次数: 0
摘要
传统的软磁铁氧体制造仅限于简单的几何形状和材料,而三维打印则为复杂的设计提供了更大的灵活性。值得注意的是,软磁铁氧体对于电感式功率传输(IPT)系统中的磁耦合器(焊盘)实现高效无线功率传输至关重要。在 IPT 系统中采用软铁氧体三维打印技术可显著改进磁耦合器的设计,但这方面的研究还很有限。因此,本文首先对现有的软磁铁氧体三维打印方法进行了全面比较,以确定它们是否适用于 IPT 系统中的磁耦合器,然后提出了粘合剂喷射(BJT)作为一种潜在的三维打印方法,它具有通用性强、成本效益高、适合大规模高精度制造等特点,可适用于 IPT 磁耦合器的实现。本文通过在不同的烧结温度曲线下用锰锌铁氧体粉末三维打印环形磁芯,探讨了 BJT 的适用性。实验结果表明,3D 打印出的环形磁芯具有较高的打印精度、机械强度和 10 的相对磁导率。本文还强调了烧结温度对 3D 打印磁芯的影响,以及用 BJT 方法将软铁氧体 3D 打印用于 IPT 磁耦合器的挑战、局限性和未来研究方向。
Soft ferrite 3D printing of magnetic couplers of inductive power transfer systems
Traditional soft ferrite manufacturing is limited to simple geometries and materials, while 3D printing offers greater flexibility for complex designs. Notably, soft ferrites are crucial for magnetic couplers (pads) in inductive power transfer (IPT) systems to achieve efficient wireless power transmission. The adoption of soft ferrite 3D printing in IPT systems could lead to significantly improved magnetic coupler design, yet research in this area is limited. Hence, the paper first makes a comprehensive comparison of the existing soft ferrite 3D printing methods to ascertain their suitability for magnetic couplers in IPT systems, and then proposes the binder jetting (BJT) as a potential 3D printing approach that could be appropriate for IPT magnetic coupler implementation being versatile, cost-effective, and suitable for large-scale manufacturing with high precision. This paper explores the suitability of BJT by 3D printing toroid cores with Mn–Zn ferrite powder under different sintering temperature profiles. Experimental results are presented to show that toroid cores can be 3D printed with high printing precision, mechanical strength, and a relative permeability of 10. This paper also highlights the impact of sintering temperature on 3D-printed cores, the challenges, limitations, and future research directions of soft ferrite 3D printing for IPT magnetic couplers by the BJT method.
期刊介绍:
IET Power Electronics aims to attract original research papers, short communications, review articles and power electronics related educational studies. The scope covers applications and technologies in the field of power electronics with special focus on cost-effective, efficient, power dense, environmental friendly and robust solutions, which includes:
Applications:
Electric drives/generators, renewable energy, industrial and consumable applications (including lighting, welding, heating, sub-sea applications, drilling and others), medical and military apparatus, utility applications, transport and space application, energy harvesting, telecommunications, energy storage management systems, home appliances.
Technologies:
Circuits: all type of converter topologies for low and high power applications including but not limited to: inverter, rectifier, dc/dc converter, power supplies, UPS, ac/ac converter, resonant converter, high frequency converter, hybrid converter, multilevel converter, power factor correction circuits and other advanced topologies.
Components and Materials: switching devices and their control, inductors, sensors, transformers, capacitors, resistors, thermal management, filters, fuses and protection elements and other novel low-cost efficient components/materials.
Control: techniques for controlling, analysing, modelling and/or simulation of power electronics circuits and complete power electronics systems.
Design/Manufacturing/Testing: new multi-domain modelling, assembling and packaging technologies, advanced testing techniques.
Environmental Impact: Electromagnetic Interference (EMI) reduction techniques, Electromagnetic Compatibility (EMC), limiting acoustic noise and vibration, recycling techniques, use of non-rare material.
Education: teaching methods, programme and course design, use of technology in power electronics teaching, virtual laboratory and e-learning and fields within the scope of interest.
Special Issues. Current Call for papers:
Harmonic Mitigation Techniques and Grid Robustness in Power Electronic-Based Power Systems - https://digital-library.theiet.org/files/IET_PEL_CFP_HMTGRPEPS.pdf