提高光化学加工效率:一种多元决策方法

IF 2 Q2 ENGINEERING, MECHANICAL Frontiers in Mechanical Engineering Pub Date : 2024-02-13 DOI:10.3389/fmech.2024.1325018
G. Sapkota, Ranjan Kumar Ghadai, R. Čep, G. Shanmugasundar, J. Chohan, Kanak Kalita
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引用次数: 0

摘要

非传统加工 (NTM) 比传统工艺具有更高的几何和尺寸精度,以及更好的表面光洁度。光化学加工 (PCM) 就是这样一种利用化学蚀刻去除材料的非传统加工工艺。PCM 主要应用于制药、化工和能源行业的微通道制造。蚀刻液浓度、蚀刻时间和蚀刻液温度等几个输入参数极大地影响着加工的质量和效率。因此,优化这些参数至关重要。本研究比较分析了五种多标准决策(MCDM)技术--与理想解相似度排序技术(TOPSIS)、基于比率分析的多目标优化技术(MOORA)、添加剂比率评估技术(ARAS)、加权汇总产品评估方法(WASPAS)和多属性边界逼近区域比较方法(MABAC)--以优化 PCM 工艺。所考虑的关键性能指标包括材料去除率 (MRR)、表面粗糙度 (SR)、欠切 (Uc) 和蚀刻因子 (EF)。这些标准的权重采用标准诱导聚合技术(CRITIC)计算,并与 MEREC、熵和等权重等其他常用方法进行了比较。MRR 和 EF 被视为效益标准,而 SR 和 Uc 被视为成本标准。最佳工艺参数被确定为 850 克/升蚀刻液浓度、40 分钟蚀刻时间和 70°C 蚀刻液温度。在采用的三种 MCDM 技术中,有两种在这些最佳参数上达成了一致,从而加强了研究结果。此外,所采用的 MCDM 技术之间还存在很强的相关性,进一步验证了结果。
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Enhancing efficiency in photo chemical machining: a multivariate decision-making approach
Non-Traditional Machining (NTM) outperforms traditional processes by offering superior geometric and dimensional accuracy, along with a better surface finish. Photo Chemical Machining (PCM) represents one such NTM process, using chemical etching for material removal. PCM finds substantial application in the creation of microchannels in pharmaceutical, chemical and energy industries. Several input parameters—such as etchant concentration, etching time and etchant temperature—profoundly influence the machining’s quality and efficiency. Therefore, the optimization of these parameters is crucial. This study presents a comparative analysis of five Multiple Criteria Decision Making (MCDM) techniques—Technique for Order of Preference by Similarity to Ideal Solution (TOPSIS), Multi-Objective Optimization on the basis of Ratio Analysis (MOORA), Additive Ratio Assessment (ARAS), Weighted aggregated sum product assessment method (WASPAS) and Multi-Attributive Border Approximation Area Comparison Method (MABAC)—for the optimization of the PCM process. Key performance metrics considered are Material Removal Rate (MRR), Surface Roughness (SR), Undercut (Uc) and etch factor (EF). The weights of these criteria were calculated using the Criterion-Induced Aggregation Technique (CRITIC) and was compared with other popular methods like MEREC, Entropy and equal weights. MRR and EF are seen as beneficial criteria, while SR and Uc are perceived as cost criteria. Optimum process parameters were identified as 850 g/L etchant concentration, 40 min etching time and 70°C etchant temperature. Two of the three employed MCDM techniques agreed on these optimal parameters, reinforcing the findings. Furthermore, a strong correlation was observed amongst the employed MCDM techniques, further validating the results.
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来源期刊
Frontiers in Mechanical Engineering
Frontiers in Mechanical Engineering Engineering-Industrial and Manufacturing Engineering
CiteScore
4.40
自引率
0.00%
发文量
115
审稿时长
14 weeks
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