硅衬底对(14,14,14)-石墨烯热传输特性的双衬底效应:从传统抑制作用到异常促进作用的转变

Yufei Gao, Zheyi Zhang, Xiaoliang Zhang, Yanguang Zhou, Dawei Tang
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摘要

本研究以硅衬底支撑的(14,14,14)-石墨炔(GY)为研究对象。研究结果表明,衬底与支撑材料之间的距离(dsub-sup)越大,支撑 GY 的热导率(TC)越高,当 dsub-sup 超过一定值时,支撑 GY 的热导率甚至高于独立 GY,这说明衬底在支撑材料(SM)的热传输过程中起到了非正常的促进作用。这一现象打破了dsub-sup的增大只能导致SM的TC接近独立模型TC的传统认知。相关机理可以看作是长dsub-sup基底的弱相互作用和基底与GY之间晶格失配导致的拉伸效应的共同影响。结合声子分析,可以发现基底的影响与声子散射,即非谐性,尤其是面外方向的非谐性的关系更为密切。longdsub-sup 的反常促进效应也可归因于较弱的面外声子散射,尤其是减少的四阶声子散射。我们的研究为抑制基底对电子器件散热的负面影响提供了新思路。本文受版权保护。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Dual Substrate Effect of Silicon Substrate on Thermal Transport Characteristic of (14,14,14)‐Graphyne: Transformation from Conventional Suppressing Role to Abnormal Promoting Role
In this letter, (14,14,14)‐graphyne (GY) supported by silicon substrate is chosen to be research object. Our results demonstrate that the increasing distance between substrate and supported materials (d sub‐sup ) results in the enhancement of thermal conductivity (TC) of supported GY, and the TC of supported GY is even higher than that of free‐standing GY when d sub‐sup exceeds a certain value, which means substrate plays an abnormal promoting role in the thermal transport in supported materials (SM). This phenomenon breaks the traditional cognition that the increasing d sub‐sup can only lead to the TC of SM approaching that of free‐standing model. The related mechanism can be seen as the combined impact of weak interaction of long‐d sub‐sup substrate and tensile effect led by lattice mismatch between substrate and GY. Combining with phonon analysis, it can be observed that the influence of substrate shows closer relationship with phonon scattering, i.e., the anharmonicity, especially the anharmonicity of out‐of‐plane direction. The anomalous promoting effect of long‐d sub‐sup can be also attributed to the weaker scattering of out‐of‐plane phonon, especially the reduced four‐order phonon scattering. Our research provides a new idea to suppress the negative effect of substrate on heat dissipation in electronic devices.This article is protected by copyright. All rights reserved.
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