利用声发射法检测印刷电路板中的缺陷

S. Uvaysov, N. T. Luu, C. D. Nguyen, Th. H. Vo, A. V. Dolmatov
{"title":"利用声发射法检测印刷电路板中的缺陷","authors":"S. Uvaysov, N. T. Luu, C. D. Nguyen, Th. H. Vo, A. V. Dolmatov","doi":"10.32362/2500-316x-2024-12-1-15-29","DOIUrl":null,"url":null,"abstract":"Objectives. Defects in the form of layering may occur during lamination in the production of multilayer printed circuit boards (MPCB). These defects cannot be detected by optical and electrical methods of output control. However, they can lead to breaches of the mechanical mode of operation and failures while running radioelectronic devices. In order to detect such defects, the acoustic emission (AE) method is proposed. This is based on the occurrence and propagation of acoustic waves in MPCBs caused by the presence of defects. The aim of this study is to investigate the possibility of using the AE method to detect defects in multilayer printed circuit boards. These defects can occur, in particular, in the lamination process.Methods. A mechanical processes modeling program (for research on the MPCB model) and various samples of two-layer printed circuit boards with pre-introduced defects (for experimental studies) were used to study the propagation of acoustic signals in the MPCB in the presence of defects. A solenoid mounted on the MPCB was used as a source of acoustic signals, while a piezoelectric sensor was used to receive signals. Data processing was carried out by comparing AE signals obtained for a serviceable MPCB sample and for MPCB samples with defects.Results. Simulation of the acoustic signal propagation in MPCBs in serviceable and faulty (with a rectangular defect in the form of delamination) states was carried out to show the difference in the received signals at the sensor installation point. Experimental studies were also conducted to examine the AE method applicability for detecting defects of various sizes and quantities.Conclusions. The studies demonstrated that the AE method allows the presence of defects in MPCB occurring during the lamination process to be detected effectively and reliably. This study proposes a new approach to non-destructive testing of MPCB using the AE method. This method significantly increases the reliability of MPCBs and the efficiency of their production processes.","PeriodicalId":282368,"journal":{"name":"Russian Technological Journal","volume":"66 3","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Detection of defects in printed circuit boards by the acoustic emission method\",\"authors\":\"S. Uvaysov, N. T. Luu, C. D. Nguyen, Th. H. Vo, A. V. Dolmatov\",\"doi\":\"10.32362/2500-316x-2024-12-1-15-29\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Objectives. Defects in the form of layering may occur during lamination in the production of multilayer printed circuit boards (MPCB). These defects cannot be detected by optical and electrical methods of output control. However, they can lead to breaches of the mechanical mode of operation and failures while running radioelectronic devices. In order to detect such defects, the acoustic emission (AE) method is proposed. This is based on the occurrence and propagation of acoustic waves in MPCBs caused by the presence of defects. The aim of this study is to investigate the possibility of using the AE method to detect defects in multilayer printed circuit boards. These defects can occur, in particular, in the lamination process.Methods. A mechanical processes modeling program (for research on the MPCB model) and various samples of two-layer printed circuit boards with pre-introduced defects (for experimental studies) were used to study the propagation of acoustic signals in the MPCB in the presence of defects. A solenoid mounted on the MPCB was used as a source of acoustic signals, while a piezoelectric sensor was used to receive signals. Data processing was carried out by comparing AE signals obtained for a serviceable MPCB sample and for MPCB samples with defects.Results. Simulation of the acoustic signal propagation in MPCBs in serviceable and faulty (with a rectangular defect in the form of delamination) states was carried out to show the difference in the received signals at the sensor installation point. Experimental studies were also conducted to examine the AE method applicability for detecting defects of various sizes and quantities.Conclusions. The studies demonstrated that the AE method allows the presence of defects in MPCB occurring during the lamination process to be detected effectively and reliably. This study proposes a new approach to non-destructive testing of MPCB using the AE method. This method significantly increases the reliability of MPCBs and the efficiency of their production processes.\",\"PeriodicalId\":282368,\"journal\":{\"name\":\"Russian Technological Journal\",\"volume\":\"66 3\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Russian Technological Journal\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.32362/2500-316x-2024-12-1-15-29\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Russian Technological Journal","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.32362/2500-316x-2024-12-1-15-29","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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摘要

目标。在生产多层印刷电路板(MPCB)的层压过程中,可能会出现分层形式的缺陷。这些缺陷无法通过光学和电气输出控制方法检测出来。然而,它们会导致机械操作模式的破坏和无线电电子设备运行时的故障。为了检测这类缺陷,提出了声发射(AE)方法。这种方法是基于缺陷的存在所引起的声波在 MPCB 中的发生和传播。本研究旨在探讨使用声发射法检测多层印刷电路板缺陷的可能性。这些缺陷可能发生在层压过程中。我们使用了一个机械过程建模程序(用于研究多层印刷电路板模型)和各种预先引入缺陷的双层印刷电路板样品(用于实验研究)来研究存在缺陷时声学信号在多层印刷电路板中的传播。安装在 MPCB 上的螺线管用作声信号源,而压电传感器则用于接收信号。通过比较从可使用的 MPCB 样品和有缺陷的 MPCB 样品上获得的声波信号,进行数据处理。模拟了声学信号在可使用和有缺陷(分层形式的矩形缺陷)的 MPCB 中的传播,以显示传感器安装点接收信号的差异。还进行了实验研究,以检验 AE 方法是否适用于检测各种尺寸和数量的缺陷。研究表明,AE 方法可以有效、可靠地检测出 MPCB 在层压过程中出现的缺陷。本研究提出了一种使用 AE 方法对 MPCB 进行无损检测的新方法。这种方法大大提高了 MPCB 的可靠性及其生产过程的效率。
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Detection of defects in printed circuit boards by the acoustic emission method
Objectives. Defects in the form of layering may occur during lamination in the production of multilayer printed circuit boards (MPCB). These defects cannot be detected by optical and electrical methods of output control. However, they can lead to breaches of the mechanical mode of operation and failures while running radioelectronic devices. In order to detect such defects, the acoustic emission (AE) method is proposed. This is based on the occurrence and propagation of acoustic waves in MPCBs caused by the presence of defects. The aim of this study is to investigate the possibility of using the AE method to detect defects in multilayer printed circuit boards. These defects can occur, in particular, in the lamination process.Methods. A mechanical processes modeling program (for research on the MPCB model) and various samples of two-layer printed circuit boards with pre-introduced defects (for experimental studies) were used to study the propagation of acoustic signals in the MPCB in the presence of defects. A solenoid mounted on the MPCB was used as a source of acoustic signals, while a piezoelectric sensor was used to receive signals. Data processing was carried out by comparing AE signals obtained for a serviceable MPCB sample and for MPCB samples with defects.Results. Simulation of the acoustic signal propagation in MPCBs in serviceable and faulty (with a rectangular defect in the form of delamination) states was carried out to show the difference in the received signals at the sensor installation point. Experimental studies were also conducted to examine the AE method applicability for detecting defects of various sizes and quantities.Conclusions. The studies demonstrated that the AE method allows the presence of defects in MPCB occurring during the lamination process to be detected effectively and reliably. This study proposes a new approach to non-destructive testing of MPCB using the AE method. This method significantly increases the reliability of MPCBs and the efficiency of their production processes.
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