Gahui Kim, Kirak Son, Young-Cheon Kim, Young-Bae Park
{"title":"介质固化温度对用于 FOWLP 应用的 Cu/Ti/PBO 的界面可靠性的影响","authors":"Gahui Kim, Kirak Son, Young-Cheon Kim, Young-Bae Park","doi":"10.1007/s13391-024-00485-0","DOIUrl":null,"url":null,"abstract":"<p>In this study, the effect of curing temperatures of low-temperature curable polybenzoxazole (PBO) dielectrics on the interfacial adhesion energies between the Cu redistribution layer and PBO dielectric used in advanced fan-out packaging was systematically investigated using a four-point bending test. The results revealed that the interfacial adhesion energy increased when the PBO curing temperature increased from 175 to 200 °C, whereas it decreased when the curing temperature increased from 200 to 225 °C. The increase in the interfacial adhesion energy with an increase in the PBO curing temperature from 175 to 200 °C is attributed to the polymerization of PBO. However, the decrease in the interfacial adhesion energy as the curing temperature increases to 225 °C results from thermal stress.</p>","PeriodicalId":536,"journal":{"name":"Electronic Materials Letters","volume":"20 4","pages":"393 - 401"},"PeriodicalIF":2.1000,"publicationDate":"2024-02-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effects of Dielectric Curing Temperature on the Interfacial Reliability of Cu/Ti/PBO for FOWLP Applications\",\"authors\":\"Gahui Kim, Kirak Son, Young-Cheon Kim, Young-Bae Park\",\"doi\":\"10.1007/s13391-024-00485-0\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>In this study, the effect of curing temperatures of low-temperature curable polybenzoxazole (PBO) dielectrics on the interfacial adhesion energies between the Cu redistribution layer and PBO dielectric used in advanced fan-out packaging was systematically investigated using a four-point bending test. The results revealed that the interfacial adhesion energy increased when the PBO curing temperature increased from 175 to 200 °C, whereas it decreased when the curing temperature increased from 200 to 225 °C. The increase in the interfacial adhesion energy with an increase in the PBO curing temperature from 175 to 200 °C is attributed to the polymerization of PBO. However, the decrease in the interfacial adhesion energy as the curing temperature increases to 225 °C results from thermal stress.</p>\",\"PeriodicalId\":536,\"journal\":{\"name\":\"Electronic Materials Letters\",\"volume\":\"20 4\",\"pages\":\"393 - 401\"},\"PeriodicalIF\":2.1000,\"publicationDate\":\"2024-02-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electronic Materials Letters\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s13391-024-00485-0\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electronic Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s13391-024-00485-0","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Effects of Dielectric Curing Temperature on the Interfacial Reliability of Cu/Ti/PBO for FOWLP Applications
In this study, the effect of curing temperatures of low-temperature curable polybenzoxazole (PBO) dielectrics on the interfacial adhesion energies between the Cu redistribution layer and PBO dielectric used in advanced fan-out packaging was systematically investigated using a four-point bending test. The results revealed that the interfacial adhesion energy increased when the PBO curing temperature increased from 175 to 200 °C, whereas it decreased when the curing temperature increased from 200 to 225 °C. The increase in the interfacial adhesion energy with an increase in the PBO curing temperature from 175 to 200 °C is attributed to the polymerization of PBO. However, the decrease in the interfacial adhesion energy as the curing temperature increases to 225 °C results from thermal stress.
期刊介绍：
Electronic Materials Letters is an official journal of the Korean Institute of Metals and Materials. It is a peer-reviewed international journal publishing print and online version. It covers all disciplines of research and technology in electronic materials. Emphasis is placed on science, engineering and applications of advanced materials, including electronic, magnetic, optical, organic, electrochemical, mechanical, and nanoscale materials. The aspects of synthesis and processing include thin films, nanostructures, self assembly, and bulk, all related to thermodynamics, kinetics and/or modeling.
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