MEMS 硅谐振加速度计综述

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Microelectromechanical Systems Pub Date : 2024-01-26 DOI:10.1109/JMEMS.2024.3354235
Zhao Zhang;Hemin Zhang;Yongcun Hao;Honglong Chang
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引用次数: 0

摘要

本文回顾了从 1987 年到 2022 年硅谐振加速度计的发展历程。30 多年来,硅谐振加速度计已根据不同的传感方法发展成多种结构。据报道,起初,谐振加速度计是通过检测谐振器的频率偏移来实现加速度测量的。加速度计领域出现了各种进步,包括谐振器的多样性、比例系数的提高、传感方向的扩大、温度灵敏度的降低以及 CMOS 技术的集成等各个方面。此外,创新的加速度计设计还利用了模式定位现象、同步技术和参数调制,其总体目标是提高加速度计的性能并扩大其应用范围。本文回顾并分析了过去三十年来一系列硅谐振加速度计的性能和结构,为该领域的研究人员提供了详细的参考和指导。
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A Review on MEMS Silicon Resonant Accelerometers
This paper reviews the development of silicon resonant accelerometers from 1987 to 2022. For more than 30 years, silicon resonant accelerometers have developed into varieties of structures based on different sensing methods. In the beginning, resonant accelerometers were reported to realize acceleration measurements by detecting the frequency shifts of resonators. A variety of advancements have emerged in the realm of accelerometers, encompassing various aspects such as resonator diversity, enhancements in scale factor, expanded sensing orientations, reduced temperature sensitivity, and the integration of CMOS technology. Furthermore, innovative accelerometer designs have harnessed mode-localized phenomena, synchronization techniques, and parametric modulation, with the overarching goal of enhancing their performance and expanding their applicability. This paper reviews and analyzes the performances and structures of a range of silicon resonant accelerometers over the past three decades, providing a detailing reference and guidance for researchers in this field.
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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