基于 MEMS 技术的带定子齿的 PZT 薄膜行波微电机

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Microelectromechanical Systems Pub Date : 2024-01-09 DOI:10.1109/JMEMS.2023.3348792
Tianyu Yang;Yu Chen;Binglei Zhang;Binlei Cao;Xiaoshi Li;Kaisheng Zhang;Jiangbo He;Wei Su
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引用次数: 0

摘要

基于微机电系统(MEMS)工艺的压电薄膜行波微电机具有体积小、易于集成和批量生产等优点。然而,压电薄膜微电机仍然存在输出扭矩非常小的严重缺陷。本文提出了一种新型带定子齿的锆钛酸铅(PZT)压电薄膜电机,以提高输出扭矩。首先,通过理论分析和有限元模拟确定了定子齿的设计参数。结合晶圆级 MEMS 制造技术完成了器件制备,其中基于深反应离子刻蚀(DRIE)工艺对 PZT-SOI 晶圆的基底硅层进行减薄和刻蚀,以形成定子齿结构。最后,性能测试结果表明,新型电机在4.5 Vpp的低驱动电压下实现了39.4 \text{N}\cdot \text{m}$的大输出扭矩。与之前报道的驱动电压高达 11 Vpp 的压电薄膜电机相比,大输出扭矩高出 2.65 倍。[2023-0099]
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A PZT Thin-Film Traveling-Wave Micro-Motor With Stator Teeth Based on MEMS Technology
The piezoelectric thin-film traveling-wave micro-motor based on the microelectromechanical systems (MEMS) process has the advantages of compact size, easy integration and batch production. However, the piezoelectric thin-film micro-motor still exits a serious shortcoming of very small output torque. This paper proposes a novel lead zirconate titanate (PZT) piezoelectric thin-film motor with stator teeth to improve the output torque. Firstly, theoretical analysis and finite element simulations were performed to determine the design parameters of the stator teeth. The device preparation is completed by combining with wafer-scale MEMS fabrication techniques, in which the base Si layer of PZT-SOI wafer is thinned and etched to form the stator tooth structure based on the deep reactive ion etching (DRIE) process. Finally, the performance testing results showed that the novel motor achieved a large output torque of $39.4 \mu \text{N}\cdot \text{m}$ under a low driving voltage of 4.5 Vpp. The large output torque is 2.65 times higher than that of the previously reported piezoelectric thin-film motor with a much higher driving voltage of 11 Vpp. [2023-0099]
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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