基于带结构的UTB SOI 器件静电分析:辐射诱导的界面陷阱与带边缘能量的相关性

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Device and Materials Reliability Pub Date : 2024-02-16 DOI:10.1109/TDMR.2024.3366592
Nalin Vilochan Mishra;Aditya Sankar Medury
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引用次数: 0

摘要

辐射对半导体-氧化物界面的影响(诱导界面陷阱态)通常只能通过实验测量,因此很难量化辐射对器件静电的影响。对于超薄体 (UTB) MOS 器件,如果用一维泊松方程自洽地求解沿禁锢方向的一维带状结构,同时改变硅-硅氧烷 (SiO_{2}$) 界面的带边能量 $(\Delta E_{edge})$,就能量化界面陷阱态对沟道静电的影响,同时还能考虑量子禁锢效应。在这项工作中,我们提出了一种将辐射剂量与能带边缘能量$(\Delta E_{edge})$相关联的方法,从而使基于沟道厚度能带结构的方法能够用于量化这些辐射诱导的陷阱对器件静电的影响。我们展示了一种将 $\Delta E_{edge}$ 变化引起的界面电荷与 $Si-SiO_{2}$ 界面上不同辐射粒子引起的电荷产率联系起来的方法。在确定了不同粒子和剂量的 $\Delta E_{edge}$ 适当值之后,我们就可以利用基于原子带状结构的方法,在广泛的沟道厚度范围内精确模拟辐射对沟道静电造成的衰减。我们还展示了一种将该方法扩展到较低器件温度的方法,从而有效地量化了辐射剂量对UTB器件静电的影响,适用于较宽的器件温度范围。
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Correlation of Radiation-Induced Interface Traps With Band Edge Energy Through Band Structure-Based Analysis of Electrostatics of UTB SOI Devices
The effect of Radiation on the semiconductor-oxide interface, inducing interface trap states, has generally only been experimentally measured, which makes it difficult to quantify the impact of this radiation on device electrostatics. For an Ultra-Thin-Body (UTB) MOS device, the 1-D Band structure along the direction of confinement, if solved self-consistently with the 1-D Poisson’s equation, while varying the band edge energy $(\Delta E_{edge})$ at the $Si-SiO_{2}$ interface, can enable the quantification of the effect of interface trap states on channel electrostatics, while also accounting for Quantum Confinement Effects. In this work, we present an approach to correlate the radiation dose to the band edge energy $(\Delta E_{edge})$ , thus enabling the channel thickness dependent band structure-based approach to be used to quantify the effect of these radiation-induced traps on the device electrostatics. We show a methodology that co-relates the interface charge induced by $\Delta E_{edge}$ variation and the charge yield, due to different radiating particles, on the $Si-SiO_{2}$ interface. After identifying appropriate values of $\Delta E_{edge}$ for different particles and doses, the degradation due to radiation on the channel electrostatics can be accurately simulated, for a wide range of channel thicknesses with the atomistic band structure-based methodology. We also show an approach to extend this methodology to lower device temperatures, thus effectively quantifying the effect of radiation dose on UTB device electrostatics for a wide range of device temperatures.
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来源期刊
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Device and Materials Reliability 工程技术-工程:电子与电气
CiteScore
4.80
自引率
5.00%
发文量
71
审稿时长
6-12 weeks
期刊介绍: The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.
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