Shiyao Du, Feng Li, Flemming Bjerg Grumsen, Rajan Ambat, Ao Tang, Ying Li
{"title":"偏置电位和尺寸对植入式设备电容器电化学迁移的影响","authors":"Shiyao Du, Feng Li, Flemming Bjerg Grumsen, Rajan Ambat, Ao Tang, Ying Li","doi":"10.1038/s41529-024-00440-2","DOIUrl":null,"url":null,"abstract":"Dendrite formation induced by electrochemical migration (ECM) is a common reliability problem occurring on printed circuit boards (PCBs), which significantly threatens the long-term safe operations of current implantable electronic devices (IEDs). Although several factors (i.e., contaminations, humidity, temperature) are proved to be the parameters closely related to ECM susceptibility of capacitors on a PCB under climate environments, further targeted research under other environments still needs to be conducted as ECM is highly environmental-dependent. Herein, the effects of bias potential and pitch dimension on ECM sensitivity are systematically studied using various sizes of capacitors on a test PCB under a human implantation environment. The finite element method first proves that a DC voltage pattern could be regarded as an accelerated test compared to other waveforms. Subsequent chronoamperometry tests using the DC potential further indicate that dendrite formation is closely related to pitch dimension under low bias potential, while under high bias potential electric field is also the dominating factor of dendrite formation for capacitors on a PCB. Benefiting from the electrochemical impedance spectroscopy (EIS) technique, the capacitor reliability under different corrosion states is also evaluated in a detailed manner. This work offers great value both in electronic corrosion mechanisms and future rational design for reliable IEDs.","PeriodicalId":19270,"journal":{"name":"npj Materials Degradation","volume":null,"pages":null},"PeriodicalIF":6.6000,"publicationDate":"2024-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.nature.com/articles/s41529-024-00440-2.pdf","citationCount":"0","resultStr":"{\"title\":\"Effect of bias potential and dimension on electrochemical migration of capacitors for implantable devices\",\"authors\":\"Shiyao Du, Feng Li, Flemming Bjerg Grumsen, Rajan Ambat, Ao Tang, Ying Li\",\"doi\":\"10.1038/s41529-024-00440-2\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Dendrite formation induced by electrochemical migration (ECM) is a common reliability problem occurring on printed circuit boards (PCBs), which significantly threatens the long-term safe operations of current implantable electronic devices (IEDs). Although several factors (i.e., contaminations, humidity, temperature) are proved to be the parameters closely related to ECM susceptibility of capacitors on a PCB under climate environments, further targeted research under other environments still needs to be conducted as ECM is highly environmental-dependent. Herein, the effects of bias potential and pitch dimension on ECM sensitivity are systematically studied using various sizes of capacitors on a test PCB under a human implantation environment. The finite element method first proves that a DC voltage pattern could be regarded as an accelerated test compared to other waveforms. Subsequent chronoamperometry tests using the DC potential further indicate that dendrite formation is closely related to pitch dimension under low bias potential, while under high bias potential electric field is also the dominating factor of dendrite formation for capacitors on a PCB. Benefiting from the electrochemical impedance spectroscopy (EIS) technique, the capacitor reliability under different corrosion states is also evaluated in a detailed manner. This work offers great value both in electronic corrosion mechanisms and future rational design for reliable IEDs.\",\"PeriodicalId\":19270,\"journal\":{\"name\":\"npj Materials Degradation\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":6.6000,\"publicationDate\":\"2024-03-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.nature.com/articles/s41529-024-00440-2.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"npj Materials Degradation\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.nature.com/articles/s41529-024-00440-2\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"npj Materials Degradation","FirstCategoryId":"88","ListUrlMain":"https://www.nature.com/articles/s41529-024-00440-2","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Effect of bias potential and dimension on electrochemical migration of capacitors for implantable devices
Dendrite formation induced by electrochemical migration (ECM) is a common reliability problem occurring on printed circuit boards (PCBs), which significantly threatens the long-term safe operations of current implantable electronic devices (IEDs). Although several factors (i.e., contaminations, humidity, temperature) are proved to be the parameters closely related to ECM susceptibility of capacitors on a PCB under climate environments, further targeted research under other environments still needs to be conducted as ECM is highly environmental-dependent. Herein, the effects of bias potential and pitch dimension on ECM sensitivity are systematically studied using various sizes of capacitors on a test PCB under a human implantation environment. The finite element method first proves that a DC voltage pattern could be regarded as an accelerated test compared to other waveforms. Subsequent chronoamperometry tests using the DC potential further indicate that dendrite formation is closely related to pitch dimension under low bias potential, while under high bias potential electric field is also the dominating factor of dendrite formation for capacitors on a PCB. Benefiting from the electrochemical impedance spectroscopy (EIS) technique, the capacitor reliability under different corrosion states is also evaluated in a detailed manner. This work offers great value both in electronic corrosion mechanisms and future rational design for reliable IEDs.
期刊介绍:
npj Materials Degradation considers basic and applied research that explores all aspects of the degradation of metallic and non-metallic materials. The journal broadly defines ‘materials degradation’ as a reduction in the ability of a material to perform its task in-service as a result of environmental exposure.
The journal covers a broad range of topics including but not limited to:
-Degradation of metals, glasses, minerals, polymers, ceramics, cements and composites in natural and engineered environments, as a result of various stimuli
-Computational and experimental studies of degradation mechanisms and kinetics
-Characterization of degradation by traditional and emerging techniques
-New approaches and technologies for enhancing resistance to degradation
-Inspection and monitoring techniques for materials in-service, such as sensing technologies