Syed Farah Naz;Debabrata Mondal;Ambika Prasad Shah
{"title":"用于核安全环境的抗侧信道攻击 RHBD 12T SRAM 单元","authors":"Syed Farah Naz;Debabrata Mondal;Ambika Prasad Shah","doi":"10.1109/TDMR.2023.3346752","DOIUrl":null,"url":null,"abstract":"Extremely energetic particles in the nuclear environment make memory cells prone to soft errors. Also, attackers extract secret data of SRAM cells via side-channel attacks (SCAs), and leakage power analysis attacks (LPAs) seriously threaten security systems. This paper indicates a highly effective radiation-hardened and LPA-resilient (RHLR12T) SRAM cell that is both radiation-resistant by design and LPA-resilient for nuclear applications. It offers better speed, enhanced writing stability and higher overlap percentage than other considered SRAM cells, such as 6T, Quatro, We-Quatro, and RHMD10T, utilising United Microelectronics Corporation (UMC) 45nm CMOS technology at the supply voltage of 1.0V and \n<inline-formula> <tex-math>$27\\mathrm {^{\\circ }}\\text{C}$ </tex-math></inline-formula>\n operating temperature. The proposed cell gives \n<inline-formula> <tex-math>$1.141\\mathrm {\\times }$ </tex-math></inline-formula>\n higher write stability, \n<inline-formula> <tex-math>$1.55\\mathrm {\\times }$ </tex-math></inline-formula>\n lower write access time, \n<inline-formula> <tex-math>$1.11\\mathrm {\\times }$ </tex-math></inline-formula>\n increased critical charge and \n<inline-formula> <tex-math>$1.51\\mathrm {\\times }$ </tex-math></inline-formula>\n better overlap percentage than the RHMD10T SRAM cell.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 1","pages":"59-67"},"PeriodicalIF":2.5000,"publicationDate":"2023-12-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Side-Channel Attack Resilient RHBD 12T SRAM Cell for Secure Nuclear Environment\",\"authors\":\"Syed Farah Naz;Debabrata Mondal;Ambika Prasad Shah\",\"doi\":\"10.1109/TDMR.2023.3346752\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Extremely energetic particles in the nuclear environment make memory cells prone to soft errors. Also, attackers extract secret data of SRAM cells via side-channel attacks (SCAs), and leakage power analysis attacks (LPAs) seriously threaten security systems. This paper indicates a highly effective radiation-hardened and LPA-resilient (RHLR12T) SRAM cell that is both radiation-resistant by design and LPA-resilient for nuclear applications. It offers better speed, enhanced writing stability and higher overlap percentage than other considered SRAM cells, such as 6T, Quatro, We-Quatro, and RHMD10T, utilising United Microelectronics Corporation (UMC) 45nm CMOS technology at the supply voltage of 1.0V and \\n<inline-formula> <tex-math>$27\\\\mathrm {^{\\\\circ }}\\\\text{C}$ </tex-math></inline-formula>\\n operating temperature. The proposed cell gives \\n<inline-formula> <tex-math>$1.141\\\\mathrm {\\\\times }$ </tex-math></inline-formula>\\n higher write stability, \\n<inline-formula> <tex-math>$1.55\\\\mathrm {\\\\times }$ </tex-math></inline-formula>\\n lower write access time, \\n<inline-formula> <tex-math>$1.11\\\\mathrm {\\\\times }$ </tex-math></inline-formula>\\n increased critical charge and \\n<inline-formula> <tex-math>$1.51\\\\mathrm {\\\\times }$ </tex-math></inline-formula>\\n better overlap percentage than the RHMD10T SRAM cell.\",\"PeriodicalId\":448,\"journal\":{\"name\":\"IEEE Transactions on Device and Materials Reliability\",\"volume\":\"24 1\",\"pages\":\"59-67\"},\"PeriodicalIF\":2.5000,\"publicationDate\":\"2023-12-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Device and Materials Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10373587/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10373587/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Extremely energetic particles in the nuclear environment make memory cells prone to soft errors. Also, attackers extract secret data of SRAM cells via side-channel attacks (SCAs), and leakage power analysis attacks (LPAs) seriously threaten security systems. This paper indicates a highly effective radiation-hardened and LPA-resilient (RHLR12T) SRAM cell that is both radiation-resistant by design and LPA-resilient for nuclear applications. It offers better speed, enhanced writing stability and higher overlap percentage than other considered SRAM cells, such as 6T, Quatro, We-Quatro, and RHMD10T, utilising United Microelectronics Corporation (UMC) 45nm CMOS technology at the supply voltage of 1.0V and
$27\mathrm {^{\circ }}\text{C}$
operating temperature. The proposed cell gives
$1.141\mathrm {\times }$
higher write stability,
$1.55\mathrm {\times }$
lower write access time,
$1.11\mathrm {\times }$
increased critical charge and
$1.51\mathrm {\times }$
better overlap percentage than the RHMD10T SRAM cell.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.