采用高 k 角垫片的异质结构无结 MOSFET,适用于高速和高能效应用

Mainak Mukherjee, Niloy Ghosh, Papiya Debnath, A. Sarkar, M. Chanda
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引用次数: 0

摘要

在这项研究工作中,我们提出并研究了具有硅锗源和高 K 内角间隔物的异质结构无结 MOSFET。在这篇文章中,我们证明了在优化设计的器件中,在内角隔板中引入高 k 电介质材料,而在隔板的其余部分中引入低 k 电介质材料,可大幅降低寄生电容,从而提高工作速度。研究还表明,在漏极-源极欠压状态下适当掺杂,可以通过增加有效栅极长度来改善器件的短沟道性能(SCP)。经过优化设计的器件可产生约 0.33 mA 的导通电流(ION)和约 5.55 fA 的关断电流(IOFF),ION/IOFF=6.08x1010,次阈值斜率(SS)=59.6 mV/decade,漏极诱导势垒降低(DIBL)=82.2 mV/V。本文还着重介绍了与作为逻辑门实现的无结双栅 MOSFET 相比,所提器件在速度和能耗方面的性能改进。
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Hetero-Structure Junctionless MOSFET with High-k Corner Spacer for High-Speed and Energy-Efficient Applications
In this research work, Hetero-structure Junction-less MOSFET having a Silicon-Germanium source and high-k inner corner spacer is proposed and investigated. In this article, we have shown that the introduction of a high-k dielectric material in the inner corner spacer and a low-k dielectric material in the rest of the spacer in the optimally designed device leads to a substantial reduction in parasitic capacitances, resulting in higher operating speed. It was also shown that proper doping in the drain-source underlaps regime, can improve the short channel performance (SCP) of the device by increasing the effective gate length. The optimally designed proposed device produces on current (ION) ~0.33 mA and off current (IOFF) ~ 5.55 fA along with ION/IOFF=6.08x1010, Subthreshold slope (SS)=59.6 mV/decade and drain induced barrier lowering (DIBL)=82.2 mV/V. This paper also highlights the performance improvement of the proposed device in terms of both speed and energy consumption, as compared to that of Junctionless Double Gate MOSFET when implemented as logic gates.
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来源期刊
Journal of Integrated Circuits and Systems
Journal of Integrated Circuits and Systems Engineering-Electrical and Electronic Engineering
CiteScore
0.90
自引率
0.00%
发文量
39
期刊介绍: This journal will present state-of-art papers on Integrated Circuits and Systems. It is an effort of both Brazilian Microelectronics Society - SBMicro and Brazilian Computer Society - SBC to create a new scientific journal covering Process and Materials, Device and Characterization, Design, Test and CAD of Integrated Circuits and Systems. The Journal of Integrated Circuits and Systems is published through Special Issues on subjects to be defined by the Editorial Board. Special issues will publish selected papers from both Brazilian Societies annual conferences, SBCCI - Symposium on Integrated Circuits and Systems and SBMicro - Symposium on Microelectronics Technology and Devices.
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