{"title":"使用氮化硅膜片提高基于 MEMS 的压阻压力传感器的灵敏度","authors":"K. Das, H. Dutta","doi":"10.29292/jics.v19i1.755","DOIUrl":null,"url":null,"abstract":"In this paper, Piezoresistive Pressure Sensor (PPS) with four Polysilicon piezoresistors on Si3N4 diaphragm with improved sensitivity is successfully designed by using MEMS technology. Sensing is accomplished via deposited polysilicon resistors like metal resistors. The analytical model of PPS is optimized for location and geometry of the piezoresistors and the sensors based on different aspect ratios (both square and rectangular) have been investigated. The performance parameters like maximum deflection, maximum induced stress on the diaphragm have been compared using ANSYS and MATLAB simulation programming based on mathematical model. By interpreting the proper selection of the geometry of a thin Si3N4 diaphragm, the maximum deflection, maximum induced stress and highest sensitivity for this sensor are obtained for the diaphragm when aspect ratio is minimum. It has been found that sensitivity of the sensor is achieved when the piezoresistors are symmetrically placed at 65 m from the edges of the diaphragm. The analysis describes that the sensor based on square diaphragm is more sensitive than the rectangular one. It is influenced more powerfully by diaphragm thickness. The applied pressure range is considered from 0.5 kPa to 40 kPa. From the simulation results, the shape and the sensor design can be optimized for a highly sensitive PPS.","PeriodicalId":39974,"journal":{"name":"Journal of Integrated Circuits and Systems","volume":" 113","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Improved Sensitivity of MEMS-based Piezoresistive Pressure Sensor using Silicon Nitride Diaphragm\",\"authors\":\"K. Das, H. Dutta\",\"doi\":\"10.29292/jics.v19i1.755\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, Piezoresistive Pressure Sensor (PPS) with four Polysilicon piezoresistors on Si3N4 diaphragm with improved sensitivity is successfully designed by using MEMS technology. Sensing is accomplished via deposited polysilicon resistors like metal resistors. The analytical model of PPS is optimized for location and geometry of the piezoresistors and the sensors based on different aspect ratios (both square and rectangular) have been investigated. The performance parameters like maximum deflection, maximum induced stress on the diaphragm have been compared using ANSYS and MATLAB simulation programming based on mathematical model. By interpreting the proper selection of the geometry of a thin Si3N4 diaphragm, the maximum deflection, maximum induced stress and highest sensitivity for this sensor are obtained for the diaphragm when aspect ratio is minimum. It has been found that sensitivity of the sensor is achieved when the piezoresistors are symmetrically placed at 65 m from the edges of the diaphragm. The analysis describes that the sensor based on square diaphragm is more sensitive than the rectangular one. It is influenced more powerfully by diaphragm thickness. The applied pressure range is considered from 0.5 kPa to 40 kPa. From the simulation results, the shape and the sensor design can be optimized for a highly sensitive PPS.\",\"PeriodicalId\":39974,\"journal\":{\"name\":\"Journal of Integrated Circuits and Systems\",\"volume\":\" 113\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Integrated Circuits and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.29292/jics.v19i1.755\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Integrated Circuits and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.29292/jics.v19i1.755","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
Improved Sensitivity of MEMS-based Piezoresistive Pressure Sensor using Silicon Nitride Diaphragm
In this paper, Piezoresistive Pressure Sensor (PPS) with four Polysilicon piezoresistors on Si3N4 diaphragm with improved sensitivity is successfully designed by using MEMS technology. Sensing is accomplished via deposited polysilicon resistors like metal resistors. The analytical model of PPS is optimized for location and geometry of the piezoresistors and the sensors based on different aspect ratios (both square and rectangular) have been investigated. The performance parameters like maximum deflection, maximum induced stress on the diaphragm have been compared using ANSYS and MATLAB simulation programming based on mathematical model. By interpreting the proper selection of the geometry of a thin Si3N4 diaphragm, the maximum deflection, maximum induced stress and highest sensitivity for this sensor are obtained for the diaphragm when aspect ratio is minimum. It has been found that sensitivity of the sensor is achieved when the piezoresistors are symmetrically placed at 65 m from the edges of the diaphragm. The analysis describes that the sensor based on square diaphragm is more sensitive than the rectangular one. It is influenced more powerfully by diaphragm thickness. The applied pressure range is considered from 0.5 kPa to 40 kPa. From the simulation results, the shape and the sensor design can be optimized for a highly sensitive PPS.
期刊介绍:
This journal will present state-of-art papers on Integrated Circuits and Systems. It is an effort of both Brazilian Microelectronics Society - SBMicro and Brazilian Computer Society - SBC to create a new scientific journal covering Process and Materials, Device and Characterization, Design, Test and CAD of Integrated Circuits and Systems. The Journal of Integrated Circuits and Systems is published through Special Issues on subjects to be defined by the Editorial Board. Special issues will publish selected papers from both Brazilian Societies annual conferences, SBCCI - Symposium on Integrated Circuits and Systems and SBMicro - Symposium on Microelectronics Technology and Devices.