使用氮化硅膜片提高基于 MEMS 的压阻压力传感器的灵敏度

K. Das, H. Dutta
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引用次数: 0

摘要

本文采用 MEMS 技术,成功设计出在 Si3N4 膜片上安装四个多晶硅压敏电阻的压阻压力传感器 (PPS),并提高了灵敏度。传感是通过像金属电阻器一样的沉积多晶硅电阻器实现的。根据压敏电阻的位置和几何形状对 PPS 的分析模型进行了优化,并对基于不同长宽比(正方形和长方形)的传感器进行了研究。在数学模型的基础上,使用 ANSYS 和 MATLAB 仿真程序比较了隔膜上的最大挠度、最大诱导应力等性能参数。通过对 Si3N4 薄膜片几何形状的适当选择进行解释,当长宽比最小时,膜片可获得最大挠度、最大诱导应力和最高灵敏度。研究发现,当压敏电阻对称放置在离隔膜边缘 65 m 处时,传感器的灵敏度最高。分析表明,基于方形膜片的传感器比矩形膜片的灵敏度更高。膜片厚度对其影响更大。施加的压力范围为 0.5 kPa 至 40 kPa。从模拟结果来看,可以对形状和传感器设计进行优化,以获得高灵敏度的 PPS。
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Improved Sensitivity of MEMS-based Piezoresistive Pressure Sensor using Silicon Nitride Diaphragm
In this paper, Piezoresistive Pressure Sensor (PPS) with four Polysilicon piezoresistors on Si3N4 diaphragm with improved sensitivity is successfully designed by using MEMS technology. Sensing is accomplished via deposited polysilicon resistors like metal resistors. The analytical model of PPS is optimized for location and geometry of the piezoresistors and the sensors based on different aspect ratios (both square and rectangular) have been investigated. The performance parameters like maximum deflection, maximum induced stress on the diaphragm have been compared using ANSYS and MATLAB simulation programming based on mathematical model. By interpreting the proper selection of the geometry of a thin Si3N4 diaphragm, the maximum deflection, maximum induced stress and highest sensitivity for this sensor are obtained for the diaphragm when aspect ratio is minimum. It has been found that sensitivity of the sensor is achieved when the piezoresistors are symmetrically placed at 65 m from the edges of the diaphragm. The analysis describes that the sensor based on square diaphragm is more sensitive than the rectangular one. It is influenced more powerfully by diaphragm thickness. The applied pressure range is considered from 0.5 kPa to 40 kPa. From the simulation results, the shape and the sensor design can be optimized for a highly sensitive PPS.
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来源期刊
Journal of Integrated Circuits and Systems
Journal of Integrated Circuits and Systems Engineering-Electrical and Electronic Engineering
CiteScore
0.90
自引率
0.00%
发文量
39
期刊介绍: This journal will present state-of-art papers on Integrated Circuits and Systems. It is an effort of both Brazilian Microelectronics Society - SBMicro and Brazilian Computer Society - SBC to create a new scientific journal covering Process and Materials, Device and Characterization, Design, Test and CAD of Integrated Circuits and Systems. The Journal of Integrated Circuits and Systems is published through Special Issues on subjects to be defined by the Editorial Board. Special issues will publish selected papers from both Brazilian Societies annual conferences, SBCCI - Symposium on Integrated Circuits and Systems and SBMicro - Symposium on Microelectronics Technology and Devices.
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