{"title":"利用非等温 DSC 分析环氧树脂粘合剂的固化动力学","authors":"Wiwiek Utami Dewi, Rizky Sutrisna, Heru Supriyatno, S. Astutiningsih, Mochamad Chalid","doi":"10.4028/p-e5vlmg","DOIUrl":null,"url":null,"abstract":"Non-isothermal DSC has been used to investigate the curing kinetics of epoxy adhesives (DGEBA-cycloaliphatic amine). The epoxy samples were scanned on DSC with five heating rates (5°C/min, 7.5°C/min, 10°C/min, 12.5°C/min, and 15°C/min). The curing kinetics were obtained through ASTM standards E2890 and E698 (the Ozawa and Kissinger methods). The kinetic parameters obtained include Ea (activation energy), A (pre-exponential factor), and n (reaction order). The activation energy calculated from the Kissinger and Ozawa method was slightly different but insignificant. The reaction rate (dα/dt) and degree of curing/conversion (α) relationship towards temperature (T), and time (t) was also investigated. The curing process's reaction rate (dα/dt) has maximum value; it can no longer increase after a specific conversion rate (α).","PeriodicalId":507742,"journal":{"name":"Materials Science Forum","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2024-02-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Curing Kinetics of Epoxy Adhesive by Non-Isothermal DSC\",\"authors\":\"Wiwiek Utami Dewi, Rizky Sutrisna, Heru Supriyatno, S. Astutiningsih, Mochamad Chalid\",\"doi\":\"10.4028/p-e5vlmg\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Non-isothermal DSC has been used to investigate the curing kinetics of epoxy adhesives (DGEBA-cycloaliphatic amine). The epoxy samples were scanned on DSC with five heating rates (5°C/min, 7.5°C/min, 10°C/min, 12.5°C/min, and 15°C/min). The curing kinetics were obtained through ASTM standards E2890 and E698 (the Ozawa and Kissinger methods). The kinetic parameters obtained include Ea (activation energy), A (pre-exponential factor), and n (reaction order). The activation energy calculated from the Kissinger and Ozawa method was slightly different but insignificant. The reaction rate (dα/dt) and degree of curing/conversion (α) relationship towards temperature (T), and time (t) was also investigated. The curing process's reaction rate (dα/dt) has maximum value; it can no longer increase after a specific conversion rate (α).\",\"PeriodicalId\":507742,\"journal\":{\"name\":\"Materials Science Forum\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-02-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Science Forum\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4028/p-e5vlmg\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science Forum","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4028/p-e5vlmg","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Curing Kinetics of Epoxy Adhesive by Non-Isothermal DSC
Non-isothermal DSC has been used to investigate the curing kinetics of epoxy adhesives (DGEBA-cycloaliphatic amine). The epoxy samples were scanned on DSC with five heating rates (5°C/min, 7.5°C/min, 10°C/min, 12.5°C/min, and 15°C/min). The curing kinetics were obtained through ASTM standards E2890 and E698 (the Ozawa and Kissinger methods). The kinetic parameters obtained include Ea (activation energy), A (pre-exponential factor), and n (reaction order). The activation energy calculated from the Kissinger and Ozawa method was slightly different but insignificant. The reaction rate (dα/dt) and degree of curing/conversion (α) relationship towards temperature (T), and time (t) was also investigated. The curing process's reaction rate (dα/dt) has maximum value; it can no longer increase after a specific conversion rate (α).