Experimental analysis of a heat pipe-assisted flexible heat transfer device

The present study elucidates the experimental investigations on a novel flexible heat transfer device that can be used in a wide range of modern electronic device cooling applications which demand flexibility. The objective of the present is to address the challenges encountered by current flexible heat transfer devices, including concerns related to out-gassing and the permeation of non-condensable gases. These issues ultimately contribute to the deterioration of the long-term dependability of such devices. The present study provides an analysis of the steady-state performance of the flexible heat transfer device under various heat loads and orientations (0°, 45°, and 90° angles). Using COMSOL Multiphysics 6.1, numerical simulations are performed to explain the dynamics of heat transfer of the flexible heat transfer device developed. The performance is evaluated in terms of thermal resistance, equivalent thermal conductivity, and average temperature difference across the evaporator and condenser. Under steady-state operation, it has been determined that the flexible heat transfer device exhibits a minimum thermal resistance of 2.3 °C/W. Additionally, a maximum effective thermal conductivity of 2407 W/mK has been reported for a bending angle of 45°, which is six times more than relevant flexible heat transfer devices, such as copper thermal straps.