铜离子在现代聚合物复合材料抗真菌破坏中的作用

IF 1.3 4区 生物学 Q4 MICROBIOLOGY Microbiology Pub Date : 2024-04-01 DOI:10.1134/s0026261723604141
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引用次数: 0

摘要

摘要 聚合物复合材料的抗生物破坏性是当今亟待解决的问题之一。在基于 ED-20 环氧树脂的聚合物复合材料中加入 Cu2O (I) 可以提高其杀菌性能。在矿物质和有机物污染的条件下,随着复合材料中分散颗粒浓度的增加,受微霉菌影响的样品面积也随之减少。填充了聚乳酸封装颗粒的样品受影响的面积比填充了非封装颗粒的复合材料小 1.5 倍。与不含 Cu2O 的变体相比,氧化铜对样品表面占优势的黑曲霉菌株有毒性作用,导致 Czapek-Dox 琼脂培养基上的平均径向生长速度和液体培养基中微霉菌生长过程中的生物量重量浓度下降。
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Role of Copper Ions in Resistance of Modern Polymer Composite Materials to Fungal Damage

Abstract

Resistance of polymer composite materials to biodamage is one of the pressing problems of our time. Incorporation of Cu2O (I) in the composition of a polymer composite based on the ED-20 epoxy resin increases its biocidal properties. Under conditions of mineral and organic contamination, the area of the samples affected by micromycetes was found to decrease with increasing concentration of dispersed particles in the composite. The affected area of the samples filled with the particles encapsulated in polylactide was 1.5 times smaller than that of the composites filled with non-encapsulated particles. Copper oxide had a toxic effect on the Aspergillus niger strain dominant on the surface of the samples, causing a decrease in the average radial growth rate on the Czapek–Dox agar medium and in the biomass weight concentration during the growth of micromycetes in a liquid medium compared to the variant without Cu2O.

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来源期刊
Microbiology
Microbiology 生物-微生物学
CiteScore
2.40
自引率
13.30%
发文量
60
审稿时长
6-12 weeks
期刊介绍: Microbiology is an is an international peer reviewed journal that covers a wide range of problems in the areas of fundamental and applied microbiology. The journal publishes experimental and theoretical papers, reviews on modern trends in different fields of microbiological science, and short communications with descriptions of unusual observations. The journal welcomes manuscripts from all countries in the English or Russian language.
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