{"title":"在硅光子芯片上操纵热通量以抑制热串扰","authors":"Nannan Ning, Qiang Zhang, Qikai Huang, Yuehai Wang, Bihu Lv, Kun Yin, Jianyi Yang, Hui Yu","doi":"10.1063/5.0193387","DOIUrl":null,"url":null,"abstract":"The integration density of silicon photonic integrated circuit (PIC) is ultimately constrained by various crosstalk mechanisms on the chip. Among them, the most prominent limiting factor is the thermal crosstalk due to the wide use of the thermo-optic effect. High-density silicon PICs strongly demand an advanced structure with better thermal crosstalk suppression ability than the traditional air isolation trench. Inspired by the thermal-metamaterial based on the scattering-cancellation method, we demonstrate a closed heat shield (CHS) structure on a silicon PIC chip, which can manipulate the thermal flux to bypass the temperature-sensitive silicon photonics components. The on-chip CHS structure is a bilayer cylindrical shell fabricated by the standard silicon photonics processing flow. Its outer and inner shell layers are formed by a 6-μm-wide interconnection metal and 4-μm-wide air trench, respectively. Plenty of temperature-sensitive micro-ring resonators inside the CHS are used to probe the temperature profile. The measurement results show that the CHS can reduce the local temperatures by 50%/44%/36% at the locations 29/41/83 μm away from the external heater. In contrast, the conventional air trench of the same dimension reduces the local temperatures by 32%/28%/21% at the same positions. In addition, the response time of the thermal field inside the CHS is around one-half of that in the conventional air trench. Furthermore, the simulation result indicates that if the outer shell of the CHS can contact with the silicon substrate by utilizing the through-silicon-via structure, the thermal crosstalk suppression ability can be improved significantly.","PeriodicalId":8198,"journal":{"name":"APL Photonics","volume":"73 1","pages":""},"PeriodicalIF":5.4000,"publicationDate":"2024-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal flux manipulation on the silicon photonic chip to suppress the thermal crosstalk\",\"authors\":\"Nannan Ning, Qiang Zhang, Qikai Huang, Yuehai Wang, Bihu Lv, Kun Yin, Jianyi Yang, Hui Yu\",\"doi\":\"10.1063/5.0193387\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The integration density of silicon photonic integrated circuit (PIC) is ultimately constrained by various crosstalk mechanisms on the chip. Among them, the most prominent limiting factor is the thermal crosstalk due to the wide use of the thermo-optic effect. High-density silicon PICs strongly demand an advanced structure with better thermal crosstalk suppression ability than the traditional air isolation trench. Inspired by the thermal-metamaterial based on the scattering-cancellation method, we demonstrate a closed heat shield (CHS) structure on a silicon PIC chip, which can manipulate the thermal flux to bypass the temperature-sensitive silicon photonics components. The on-chip CHS structure is a bilayer cylindrical shell fabricated by the standard silicon photonics processing flow. Its outer and inner shell layers are formed by a 6-μm-wide interconnection metal and 4-μm-wide air trench, respectively. Plenty of temperature-sensitive micro-ring resonators inside the CHS are used to probe the temperature profile. The measurement results show that the CHS can reduce the local temperatures by 50%/44%/36% at the locations 29/41/83 μm away from the external heater. In contrast, the conventional air trench of the same dimension reduces the local temperatures by 32%/28%/21% at the same positions. In addition, the response time of the thermal field inside the CHS is around one-half of that in the conventional air trench. Furthermore, the simulation result indicates that if the outer shell of the CHS can contact with the silicon substrate by utilizing the through-silicon-via structure, the thermal crosstalk suppression ability can be improved significantly.\",\"PeriodicalId\":8198,\"journal\":{\"name\":\"APL Photonics\",\"volume\":\"73 1\",\"pages\":\"\"},\"PeriodicalIF\":5.4000,\"publicationDate\":\"2024-04-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"APL Photonics\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://doi.org/10.1063/5.0193387\",\"RegionNum\":1,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"OPTICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"APL Photonics","FirstCategoryId":"101","ListUrlMain":"https://doi.org/10.1063/5.0193387","RegionNum":1,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"OPTICS","Score":null,"Total":0}
Thermal flux manipulation on the silicon photonic chip to suppress the thermal crosstalk
The integration density of silicon photonic integrated circuit (PIC) is ultimately constrained by various crosstalk mechanisms on the chip. Among them, the most prominent limiting factor is the thermal crosstalk due to the wide use of the thermo-optic effect. High-density silicon PICs strongly demand an advanced structure with better thermal crosstalk suppression ability than the traditional air isolation trench. Inspired by the thermal-metamaterial based on the scattering-cancellation method, we demonstrate a closed heat shield (CHS) structure on a silicon PIC chip, which can manipulate the thermal flux to bypass the temperature-sensitive silicon photonics components. The on-chip CHS structure is a bilayer cylindrical shell fabricated by the standard silicon photonics processing flow. Its outer and inner shell layers are formed by a 6-μm-wide interconnection metal and 4-μm-wide air trench, respectively. Plenty of temperature-sensitive micro-ring resonators inside the CHS are used to probe the temperature profile. The measurement results show that the CHS can reduce the local temperatures by 50%/44%/36% at the locations 29/41/83 μm away from the external heater. In contrast, the conventional air trench of the same dimension reduces the local temperatures by 32%/28%/21% at the same positions. In addition, the response time of the thermal field inside the CHS is around one-half of that in the conventional air trench. Furthermore, the simulation result indicates that if the outer shell of the CHS can contact with the silicon substrate by utilizing the through-silicon-via structure, the thermal crosstalk suppression ability can be improved significantly.
APL PhotonicsPhysics and Astronomy-Atomic and Molecular Physics, and Optics
CiteScore
10.30
自引率
3.60%
发文量
107
审稿时长
19 weeks
期刊介绍:
APL Photonics is the new dedicated home for open access multidisciplinary research from and for the photonics community. The journal publishes fundamental and applied results that significantly advance the knowledge in photonics across physics, chemistry, biology and materials science.