掺锑金红石型二氧化锡薄膜的载流子密度控制与垂直肖特基势垒二极管的制造

Yui Takahashi, Hitoshi Takane, Hirokazu Izumi, Takeru Wakamatsu, Yuki Isobe, Kentaro Kaneko, Katsuhisa Tanaka
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引用次数: 0

摘要

我们报告了通过掺杂锑来控制生长在等结构 r-TiO2 基底上的 r-SnO2 薄膜中的载流子密度,旨在实现功率电子应用。载流子密度的调节范围为 3×1016 -2×1019 cm-3。薄膜中存在两种活化能不同的供体,分别是锡位点上的锑和氧空位。这两种活化能都随着锑浓度的增加而降低。采用 Sb:r-SnO2/Nb:r-TiO2 的垂直肖特基势垒二极管具有明显的整流特性,在 ± 1V 时的整流比为 103。
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Carrier density control of Sb-doped rutile-type SnO2 thin films and fabrication of a vertical Schottky barrier diode
We report on the control of carrier density in r-SnO2 thin films grown on isostructural r-TiO2 substrates by doping with Sb aiming for power-electronics applications. The carrier density was tuned within a range of 3×1016 −2×1019 cm−3. Two types of donors with different activation energies, attributed to Sb at Sn sites and oxygen vacancies, are present in the thin films. Both activation energies decrease as the concentration of Sb increases. A vertical Schottky barrier diode employing a Sb:r-SnO2/Nb:r-TiO2 exhibits a clear rectifying property with a rectification ratio of 103 at ± 1V.
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