观察和抑制使用卤化物化学气相沉积工艺生长的 4H-SiC 外延薄膜上形成的生长坑

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-04-30 DOI:10.1109/TSM.2024.3395361
Yoshiaki Daigo;Keisuke Kurashima;Shigeaki Ishii;Ichiro Mizushima
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引用次数: 0

摘要

本研究通过评估外延生长前基底和外延薄膜的表面形态,阐明了使用化学气相沉积反应器生长的 4H 碳化硅外延薄膜表面生长坑的起源。当薄膜在非优化条件下生长时,我们发现基底表面在外延生长前形成了大量的硅颗粒,而随后生长的外延薄膜上的大量生长凹坑则源于硅颗粒。我们观察到,通过增加气体入口外喷嘴(由内外喷嘴组成的双管结构)中的盐酸流速,成功地降低了生长坑密度。
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Observation and Suppression of Growth Pits Formed on 4H-SiC Epitaxial Films Grown Using Halide Chemical Vapor Deposition Process
In this study, the origin of growth pits on the surface of 4H-silicon carbide epitaxial films grown using a chemical vapor deposition reactor was clarified by evaluating the surface morphology of substrates immediately before the epitaxial growth and of epitaxial films. When the film was grown under non-optimized conditions, we found that numerous Si particles were formed on the surface of the substrate before the epitaxial growth and that the numerous growth pits on the subsequently grown epitaxial film were originated from Si particles. We observed that, by increasing the HCl flow rate through the outer nozzles in the gas inlet, which has a double-pipe structure consisting of inner and outer nozzles, the growth pit density was successfully decreased.
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来源期刊
IEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing 工程技术-工程:电子与电气
CiteScore
5.20
自引率
11.10%
发文量
101
审稿时长
3.3 months
期刊介绍: The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.
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