Dongmoon Min, Ilkwon Byun, Gyu-hyeon Lee, Jangwoo Kim
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CoolDC: A Cost-Effective Immersion-Cooled Datacenter with Workload-Aware Temperature Scaling
For datacenter architects, it is the most important goal to minimize the datacenter’s total cost of ownership for the target performance (i.e., TCO/performance). As the major component of a datacenter is a server farm, the most effective way of reducing TCO/performance is to improve the server’s performance and power efficiency. To achieve the goal, we claim that it is highly promising to reduce each server’s temperature to its most cost-effective point (or temperature scaling).
In this paper, we propose CoolDC, a novel and immediately-applicable low-temperature cooling method to minimize the datacenter’s TCO. The key idea is to find and apply the most cost-effective sub-freezing temperature to target servers and workloads. For that purpose, we first apply the immersion cooling method to the entire servers to maintain a stable low temperature with little extra cooling and maintenance costs. Second, we define the TCO-optimal temperature for datacenter operation (e.g., 248K~273K (-25℃~0℃)) by carefully estimating all the costs and benefits at low temperatures. Finally, we propose CoolDC, our immersion-cooling datacenter architecture to run every workload at its own TCO-optimal temperature. By incorporating our low-temperature workload-aware temperature scaling, CoolDC achieves 12.7% and 13.4% lower TCO/performance than the conventional air-cooled and immersion-cooled datacenters, respectively, without any modification to existing computers.
期刊介绍:
ACM Transactions on Architecture and Code Optimization (TACO) focuses on hardware, software, and system research spanning the fields of computer architecture and code optimization. Articles that appear in TACO will either present new techniques and concepts or report on experiences and experiments with actual systems. Insights useful to architects, hardware or software developers, designers, builders, and users will be emphasized.