{"title":"通过 TCAD 仿真揭示氧化物局部稀化 (OLT) 门控 MIS 隧道二极管中低于 60 mV/decade 的次阈值波动","authors":"Sung-Wei Huang, Jun-Yu Lin, J. Hwu","doi":"10.1149/11305.0009ecst","DOIUrl":null,"url":null,"abstract":"In this study, we unveil the sub-60 mV/decade subthreshold swing (SS) characteristics observed in the oxide local thinning (OLT) gated p-type metal-insulator-semiconductor (MIS) tunnel diodes (TD) utilizing TCAD simulations. Through our simulations, we successfully replicate the sub-60 mV/decade SS behavior and attribute this remarkable characteristic to the rapid increase in electron density near the gate edge. This phenomenon arises from electron injection through the gate OLT region under a negative gate voltage, leading to a significant elevation in electron density near the gate edge. Armed with this insight, we design scaled devices to assess the feasibility of achieving sub-60 mV/decade SS behavior. By modulating the substrate thickness, we effectively simulate devices with SS lower than 60 mV/decade across a current range spanning 8 orders of magnitude.","PeriodicalId":11473,"journal":{"name":"ECS Transactions","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2024-05-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Unveiling Sub-60 mV/decade Subthreshold Swing in The Oxide Local Thinning (OLT) Gated MIS Tunnel Diodes by TCAD Simulations\",\"authors\":\"Sung-Wei Huang, Jun-Yu Lin, J. Hwu\",\"doi\":\"10.1149/11305.0009ecst\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this study, we unveil the sub-60 mV/decade subthreshold swing (SS) characteristics observed in the oxide local thinning (OLT) gated p-type metal-insulator-semiconductor (MIS) tunnel diodes (TD) utilizing TCAD simulations. Through our simulations, we successfully replicate the sub-60 mV/decade SS behavior and attribute this remarkable characteristic to the rapid increase in electron density near the gate edge. This phenomenon arises from electron injection through the gate OLT region under a negative gate voltage, leading to a significant elevation in electron density near the gate edge. Armed with this insight, we design scaled devices to assess the feasibility of achieving sub-60 mV/decade SS behavior. By modulating the substrate thickness, we effectively simulate devices with SS lower than 60 mV/decade across a current range spanning 8 orders of magnitude.\",\"PeriodicalId\":11473,\"journal\":{\"name\":\"ECS Transactions\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-05-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ECS Transactions\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1149/11305.0009ecst\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ECS Transactions","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1149/11305.0009ecst","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
在本研究中,我们利用 TCAD 仿真揭示了在氧化物局部减薄(OLT)栅极 p 型金属-绝缘体-半导体(MIS)隧道二极管(TD)中观察到的低于 60 mV/decade 的阈下摆动(SS)特性。通过模拟,我们成功地复制了低于 60 mV/decade 的 SS 行为,并将这一显著特点归因于栅极边缘附近电子密度的快速增加。这一现象源于在负栅极电压下电子通过栅极 OLT 区域注入,导致栅极边缘附近电子密度显著增加。基于这一认识,我们设计了按比例放大的器件,以评估实现低于 60 mV/decade SS 行为的可行性。通过调节衬底厚度,我们有效地模拟了在 8 个数量级的电流范围内 SS 低于 60 mV/decade 的器件。
Unveiling Sub-60 mV/decade Subthreshold Swing in The Oxide Local Thinning (OLT) Gated MIS Tunnel Diodes by TCAD Simulations
In this study, we unveil the sub-60 mV/decade subthreshold swing (SS) characteristics observed in the oxide local thinning (OLT) gated p-type metal-insulator-semiconductor (MIS) tunnel diodes (TD) utilizing TCAD simulations. Through our simulations, we successfully replicate the sub-60 mV/decade SS behavior and attribute this remarkable characteristic to the rapid increase in electron density near the gate edge. This phenomenon arises from electron injection through the gate OLT region under a negative gate voltage, leading to a significant elevation in electron density near the gate edge. Armed with this insight, we design scaled devices to assess the feasibility of achieving sub-60 mV/decade SS behavior. By modulating the substrate thickness, we effectively simulate devices with SS lower than 60 mV/decade across a current range spanning 8 orders of magnitude.