利用高斯混杂图为协同增材制造进行随机缺陷定位

IF 2.6 3区 工程技术 Q2 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS Journal of Computing and Information Science in Engineering Pub Date : 2024-05-15 DOI:10.1115/1.4065525
Sean Rescsanski, Vihaan Shah, Jiong Tang, Farhad Imani
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引用次数: 0

摘要

机器人增材制造(RAM)通过利用高自由度机器和多机器人合作,与传统的有界设计(如龙门)相比,在最大制造体积方面有显著改进。然而,与传统系统一样,合作式 RAM 也面临着缺陷产生的挑战,因此有必要改进对制造部件缺陷的检测和预防。质量保证可以通过集成 AM 模型得到进一步加强,该模型利用传感器反馈定位缺陷,大大减少了误报。这项研究通过模拟传感数据创建的新型动态缺陷模型来探索缺陷定位。具体而言,模拟两个合作机器人估算缺陷参数,同时观察工作空间并对零件的不同区域进行精确分类,生成高斯混合图,根据缺陷类型和特征识别并分配适当的操作。实验结果表明,实施动态缺陷模型和选择性重新评估后,有效缺陷检测准确率达到 99.9%,在没有定位的情况下提高了 9.9%。所提出的框架有望应用于使用高自由度机器和协作代理的领域,提供可扩展性,提高制造速度,并增强机械性能。
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Stochastic Defect Localization for Cooperative Additive Manufacturing using Gaussian Mixture Maps
Robotic additive manufacturing (RAM) offers significant improvements in maximum build volume compared to conventional bounded designs (e.g., gantry) by leveraging high degree of freedom machines and multi-robot cooperation. However, cooperative RAM suffers from the same defect generation challenges as conventional systems, necessitating improvements in the detection and prevention of flaws within fabricated components. Quality assurance can be further bolstered through the integration of AM models, which utilize sensor feedback to localize defects, vastly reducing false positives. This research explores defect localization through a novel dynamic defect model created from simulated sensing data. In particular, two cooperative robots are simulated to estimate defect parameters, while observing the workspace and accurately classifying different regions of the part, generating a Gaussian mixture map that identifies and assigns appropriate actions based on defect types and characteristics. The experimental result shows that implementation of the dynamic defect model and selective reevaluation achieved an effective defect detection accuracy of 99.9%, an improvement of 9.9% without localization. The proposed framework holds potential for application in domains that utilize high degrees of freedom machines and collaborative agents, offering scalability, improved fabrication speeds, and enhanced mechanical properties.
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来源期刊
CiteScore
6.30
自引率
12.90%
发文量
100
审稿时长
6 months
期刊介绍: The ASME Journal of Computing and Information Science in Engineering (JCISE) publishes articles related to Algorithms, Computational Methods, Computing Infrastructure, Computer-Interpretable Representations, Human-Computer Interfaces, Information Science, and/or System Architectures that aim to improve some aspect of product and system lifecycle (e.g., design, manufacturing, operation, maintenance, disposal, recycling etc.). Applications considered in JCISE manuscripts should be relevant to the mechanical engineering discipline. Papers can be focused on fundamental research leading to new methods, or adaptation of existing methods for new applications. Scope: Advanced Computing Infrastructure; Artificial Intelligence; Big Data and Analytics; Collaborative Design; Computer Aided Design; Computer Aided Engineering; Computer Aided Manufacturing; Computational Foundations for Additive Manufacturing; Computational Foundations for Engineering Optimization; Computational Geometry; Computational Metrology; Computational Synthesis; Conceptual Design; Cybermanufacturing; Cyber Physical Security for Factories; Cyber Physical System Design and Operation; Data-Driven Engineering Applications; Engineering Informatics; Geometric Reasoning; GPU Computing for Design and Manufacturing; Human Computer Interfaces/Interactions; Industrial Internet of Things; Knowledge Engineering; Information Management; Inverse Methods for Engineering Applications; Machine Learning for Engineering Applications; Manufacturing Planning; Manufacturing Automation; Model-based Systems Engineering; Multiphysics Modeling and Simulation; Multiscale Modeling and Simulation; Multidisciplinary Optimization; Physics-Based Simulations; Process Modeling for Engineering Applications; Qualification, Verification and Validation of Computational Models; Symbolic Computing for Engineering Applications; Tolerance Modeling; Topology and Shape Optimization; Virtual and Augmented Reality Environments; Virtual Prototyping
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