用于中波红外和低波红外双谱微测辐射计的等离子超材料吸收器

IF 2.8 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Micro and Nano Engineering Pub Date : 2024-05-16 DOI:10.1016/j.mne.2024.100262
Alexander Litke , Elahe Zakizade , Marvin Michel , Sascha Weyers , Anna Lena Schall-Giesecke
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引用次数: 0

摘要

本研究调查了为使用非制冷微测辐射热计进行红外多光谱成像而设计的等离子体超材料吸收器(PMA)。研究介绍了傅立叶变换红外光谱(FTIR)对由金属-绝缘体-金属叠层(MIM)组成的 PMA 的测量结果,该叠层的顶层金属为方形微块。测量结果表明,在 2 μm 至 9.2 μm 范围内,不同波长的吸收率高达 82% 至 99%。我们根据贴片的横向尺寸以及所用电介质 SiO2、Al2O3 和 Ta2O5 的折射率对光谱进行了评估。使用微带天线的传输线模型(TLM)对 TM010 模式进行的数值模拟和分析计算表明,其与测量结果在质量上非常吻合。此外,我们还制作了双谱 PMA,由两种不同贴片尺寸的 PMA 场组成,以棋盘模式排列。该图案的各个场在形状和尺寸上与间距为 12 μm 的微测辐射计相对应。在傅立叶变换红外光谱中可以看到两个不同的吸收最大值。材料、沉积方法和图案化工艺的选择适合集成到弗劳恩霍夫 IMS 现有的纳米管微测辐射热计技术中,以实现多光谱红外成像。制造工艺与 CMOS 兼容,在 8 英寸晶圆上进行。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Plasmonic metamaterial absorber for MWIR and LWIR bispectral microbolometers

Plasmonic metamaterial absorbers (PMAs) designed for multispectral imaging in the infrared (IR) with uncooled microbolometers are investigated. The study presents Fourier transform infrared spectroscopy (FTIR) measurements of PMAs consisting of metal-insulator-metal-stacks (MIM) with square-shaped micropatches as top metal layers. The measurements reveal high absorptances of 82% to 99% for distinct wavelengths within a range from 2 μm to 9.2 μm. The spectra are evaluated with respect to the lateral dimensions of the patches and to the refractive indices of the used dielectrics SiO2, Al2O3 and Ta2O5. Numerical simulations and analytical calculations of the TM010-mode using the transmission line model (TLM) for microstrip antennas show good qualitative agreement with the measurement results. Additionally, bispectral PMAs were fabricated consisting of fields of PMAs with two different patch sizes arranged in a chessboard pattern. The individual fields of this pattern correspond to microbolometers with 12 μm pitch in shape and size. Two distinct absorption maxima can be seen in the spectra measured by FTIR. The choice of materials, deposition methods and patterning processes is suitable for the integration into the existing Fraunhofer IMS's nanotube microbolometer technology to realize multispectral infrared imaging. The fabrication process is CMOS-compatible and carried out on 8-in. wafers.

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来源期刊
Micro and Nano Engineering
Micro and Nano Engineering Engineering-Electrical and Electronic Engineering
CiteScore
3.30
自引率
0.00%
发文量
67
审稿时长
80 days
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