实时预测材料去除率,实现化学机械抛光的先进过程控制

IF 3.2 3区 工程技术 Q2 ENGINEERING, INDUSTRIAL Cirp Annals-Manufacturing Technology Pub Date : 2024-01-01 DOI:10.1016/j.cirp.2024.04.028
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引用次数: 0

摘要

抛光扭矩与材料去除率密切相关,因此在监测化学机械抛光 (CMP) 过程中具有重要意义。本研究介绍了一种基于模型的新技术,用于利用 CMP 机器的过程数据估算材料去除率 (MRR)。所提出的方法采用连续最小二乘法或卡尔曼滤波器进行实时状态估计。实时估算 MRR 可实现材料去除控制,而无需依赖传统的端点检测 (EDP) 技术。通过氧化物 CMP 实验验证了所提方法的准确性,证明了在焊盘寿命即将结束时对中心慢速 MRR 曲线的精确估算。
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Real-time prediction of material removal rate for advanced process control of chemical mechanical polishing

Polishing torque holds significance in monitoring the chemical mechanical polishing (CMP) process due to its close correlation with material removal. This study introduces a new model-based technique for estimating the material removal rate (MRR) using in-process data from CMP machines. The proposed method employs either the sequential least squares method or Kalman filter for real-time state estimation. Real-time estimation of MRR enables material removal control without relying on conventional endpoint detection (EDP) technologies. The accuracy of the proposed approach is validated through oxide CMP experiments, demonstrating precise estimation of the center-slowed MRR profile towards the end of the pad life.

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来源期刊
Cirp Annals-Manufacturing Technology
Cirp Annals-Manufacturing Technology 工程技术-工程:工业
CiteScore
7.50
自引率
9.80%
发文量
137
审稿时长
13.5 months
期刊介绍: CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.
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