记忆计算系统中的信息维度匹配,用于深度神经网络的模拟部署

IF 5.3 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Advanced Electronic Materials Pub Date : 2024-05-29 DOI:10.1002/aelm.202400106
Zhe Feng, Zuheng Wu, Xu Wang, Xiuquan Fang, Xumeng Zhang, Jianxun Zou, Jian Lu, Wenbin Guo, Xing Li, Tuo Shi, Zuyu Xu, Yunlai Zhu, Fei Yang, Yuehua Dai, Qi Liu
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引用次数: 0

摘要

为提高深度神经网络(DNN)部署的计算效率,具有模拟计算能力的忆阻器被广泛研究。然而,如何充分利用忆阻器计算系统(MCS)的模拟计算能力来部署 DNN 仍是一个未决问题。本文提出了一种新的神经网络模型部署方案,即信息维度匹配(IDM)方案,以充分利用 MCS 的模拟计算能力。此外,还使用空间和时间 DNN,即卷积神经网络(CNN)和递归神经网络(RNN),分别验证了所提出的部署方案。实验结果表明,与传统的部署方案相比,所提出的部署方案在推理精度和能效方面都有明显的提高(在部署四层 DNN 的情况下提高了 4 倍),而且能效的提高随着 DNN 层数的增加而显著提高。这项工作为开发高计算效率的模拟 MCS 铺平了道路。
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Information Dimension Matching in Memristive Computing System for Analog Deployment of Deep Neural Networks
Memristor, with the ability of analog computing, is widely investigated for improving the computing efficiency of deep neural networks (DNNs) deployment. However, how to fully take advantage of the analog computing ability of memristive computing system (MCS) for DNN deployment is still an open question. Here, a new neural network models deployment scheme, that is, an information dimension matching (IDM) scheme, is proposed to fully take advantage of the analog computing ability of MCS. Furthermore, the spatial and temporal DNN, that is convolutional neural network (CNN) and recurrent neural network (RNN) is used to verify the proposed deployment scheme, respectively. The experimental results indicate that, compared to the traditional deployment schemes, the proposed deployment scheme shows obvious inference accuracy and energy efficiency improvement (>4 × in four‐layer DNNs deployment), and the energy efficiency improvement increases dramatically with the layers increment of DNNs. This work paves the path for developing high computing efficiency analog MCS.
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来源期刊
Advanced Electronic Materials
Advanced Electronic Materials NANOSCIENCE & NANOTECHNOLOGYMATERIALS SCIE-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
11.00
自引率
3.20%
发文量
433
期刊介绍: Advanced Electronic Materials is an interdisciplinary forum for peer-reviewed, high-quality, high-impact research in the fields of materials science, physics, and engineering of electronic and magnetic materials. It includes research on physics and physical properties of electronic and magnetic materials, spintronics, electronics, device physics and engineering, micro- and nano-electromechanical systems, and organic electronics, in addition to fundamental research.
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