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In-Operando 4D-STEM and STEM-EBIC Imaging of Electric Fields and Charge Carrier Behavior in Biased Silicon p–n Junctions 偏置硅p-n结中电场和载流子行为的4D-STEM和STEM-EBIC成像
IF 6.2 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2026-02-09 DOI: 10.1002/aelm.202500415
Eoin Moynihan, Yining Xie, David Cooper, Grigore Moldovan, Richard Beanland, Ana Sanchez
Electronic devices are shrinking, and scanning transmission electron microscopy is essential for the characterization of in-operando nanoscale devices. This paper demonstrates the combined capabilities of 4D-STEM and STEM-EBIC for measuring localized electronic properties (electric field strength, field direction, built-in potential, and minority carrier diffusion length) in an in-operando nanoscale device. Quantitative analysis supported by simulations enables robust interpretation of local electric fields and potential gradients. STEM-EBIC measurements at different thicknesses show a regime where the effective diffusion length of minority carriers is entirely dominated by surface recombination. In situ biasing of a symmetrically doped 4 × 1017 cm−3 p–n diode shows how 4D-STEM and STEM-EBIC complement each other for localized interpretation of electronic components.
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引用次数: 0
Lattice Dynamics of Rutile Germanium Dioxide (r-GeO2) 金红石型二氧化锗(r-GeO2)的晶格动力学
IF 6.2 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2026-02-08 DOI: 10.1002/aelm.202500586
Hans Tornatzky, Zbigniew Galazka, Tobias Schulz, Roland Gillen, Markus R. Wagner
Ultra-wide bandgap materials are pivotal for next-generation electronic and optoelectronic devices, yet their widespread adoption is impeded by challenges in bipolar doping. Rutile germanium dioxide (r-GeO2) is a promising candidate, predicted to enable ambipolar doping and to exhibit high thermal and electronic conductivity. However, critical knowledge gaps remain regarding its lattice dynamics and phonon-related properties. In this study, we use polarization angle-resolved Raman spectroscopy on high-quality, large r-GeO2 single crystals to unambiguously determine the energies and relative Raman tensor elements of all first-order Raman-active phonons. Our experimental findings are complemented by density functional perturbation theory calculations, which reveal a consistent underbinding of phonon energies across various exchange-correlation functionals. This highlights a previously unrecognized limitation in the theoretical modeling of r-GeO2. The comprehensive characterization and accurate assignment of phonon modes provide a solid foundation for quantitative simulations of phonon-assisted processes and pave the way for the design of r-GeO2-based devices.
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引用次数: 0
A Polymorphic Reconfigurable Multi‐Electrode Device Based on Electrically Bistable Nanostructured Metallic Films 一种基于电双稳纳米结构金属薄膜的多晶可重构多电极器件
IF 6.2 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2026-02-06 DOI: 10.1002/aelm.202500636
Silvia Bressan, Luca Camillini, Francesca Borghi, Giovanni Galafassi, Paolo Milani
The scale‐up of computation performances required by the rapidly increasing demand for the analysis and management of large databases poses serious doubts about the sustainability of von Neumann hardware architectures. Unconventional computing, taking inspiration from biological models and relying on self‐assembled systems based on nanoparticles and nanowires, may offer interesting alternatives. Here, we report the experimental characterization of the mechanisms that regulate the bistable electrical behavior and the resistive switching of self‐assembled gold nanostructured thin films. We show that the adaptive reconfiguration properties of the nanostructured network under specific input stimuli drive the reprogrammability of the device. We demonstrate how this system can be employed for the implementation of polymorphic devices, which can be used both as unconventional multiplexers (MUX) and as reconfigurable threshold logic gates (TLG), able to generate a complete set of Boolean functions.
{"title":"A Polymorphic Reconfigurable Multi‐Electrode Device Based on Electrically Bistable Nanostructured Metallic Films","authors":"Silvia Bressan, Luca Camillini, Francesca Borghi, Giovanni Galafassi, Paolo Milani","doi":"10.1002/aelm.202500636","DOIUrl":"https://doi.org/10.1002/aelm.202500636","url":null,"abstract":"The scale‐up of computation performances required by the rapidly increasing demand for the analysis and management of large databases poses serious doubts about the sustainability of von Neumann hardware architectures. Unconventional computing, taking inspiration from biological models and relying on self‐assembled systems based on nanoparticles and nanowires, may offer interesting alternatives. Here, we report the experimental characterization of the mechanisms that regulate the bistable electrical behavior and the resistive switching of self‐assembled gold nanostructured thin films. We show that the adaptive reconfiguration properties of the nanostructured network under specific input stimuli drive the reprogrammability of the device. We demonstrate how this system can be employed for the implementation of polymorphic devices, which can be used both as unconventional multiplexers (MUX) and as reconfigurable threshold logic gates (TLG), able to generate a complete set of Boolean functions.","PeriodicalId":110,"journal":{"name":"Advanced Electronic Materials","volume":"101 1","pages":""},"PeriodicalIF":6.2,"publicationDate":"2026-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146129429","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Materials Design Principles for Large Memory Windows: Coercive Voltage Engineering in Ferroelectric– Dielectric Heterostructures 大记忆窗材料设计原则:铁电-介电异质结构的矫顽力电压工程
IF 6.2 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2026-02-05 DOI: 10.1002/aelm.202500702
Prasanna Venkatesan, Hari Jayasankar, Salma Soliman, Priyankka Ravikumar, Lance Fernandes, Chinsung Park, Amrit Garlapati, Chengyang Zhang, Sanghyun Kang, Shimeng Yu, Suman Datta, Asif Khan, Mengkun Tian, Zheng Wang, Kijoon Kim, Kwangyou Seo, Kwangsoo Kim, Wanki Kim, Daewon Ha, Luca Larcher, Gaurav Thareja, Andrea Padovani
The integration of dielectric inserts into hafnia‐based ferroelectric stacks has emerged as a promising route to expand memory windows in ferroelectric NAND. However, the physical origin of the associated coercive voltage enhancement has remained unclear. Here, we resolve this long‐standing question by demonstrating that coercive voltage enhancement originates from resistive voltage division between the ferroelectric and dielectric layers, governed primarily by leakage in both layers. Combining Preisach modeling, defect‐based Ginestra simulations, and polarization switching experiments with external leaky dielectrics, we show that minimizing leakage in the dielectric layer ‐ intrinsically through wide‐bandgap, low‐electron‐affinity dielectrics or extrinsically by reducing defect densities ‐ provides a universal design principle for coercive voltage control. Importantly, nucleation‐limited switching kinetics remain unchanged across the heterostructures, confirming that the enhancement is driven by resistive voltage division rather than trap‐assisted mechanisms. This discovery establishes a straightforward framework for engineering large memory windows using ferroelectric–dielectric heterostructures, thereby enabling multi‐level (TLC/QLC) operation in 3D NAND. Beyond memory applications, our findings also explain the contrasting behaviors of fluorite‐ vs. perovskite‐based ferroelectric–dielectric systems, offering fundamental guidance for interfacial materials design in next‐generation electronic devices.
{"title":"Materials Design Principles for Large Memory Windows: Coercive Voltage Engineering in Ferroelectric– Dielectric Heterostructures","authors":"Prasanna Venkatesan, Hari Jayasankar, Salma Soliman, Priyankka Ravikumar, Lance Fernandes, Chinsung Park, Amrit Garlapati, Chengyang Zhang, Sanghyun Kang, Shimeng Yu, Suman Datta, Asif Khan, Mengkun Tian, Zheng Wang, Kijoon Kim, Kwangyou Seo, Kwangsoo Kim, Wanki Kim, Daewon Ha, Luca Larcher, Gaurav Thareja, Andrea Padovani","doi":"10.1002/aelm.202500702","DOIUrl":"https://doi.org/10.1002/aelm.202500702","url":null,"abstract":"The integration of dielectric inserts into hafnia‐based ferroelectric stacks has emerged as a promising route to expand memory windows in ferroelectric NAND. However, the physical origin of the associated coercive voltage enhancement has remained unclear. Here, we resolve this long‐standing question by demonstrating that coercive voltage enhancement originates from resistive voltage division between the ferroelectric and dielectric layers, governed primarily by leakage in both layers. Combining Preisach modeling, defect‐based Ginestra simulations, and polarization switching experiments with external leaky dielectrics, we show that minimizing leakage in the dielectric layer ‐ intrinsically through wide‐bandgap, low‐electron‐affinity dielectrics or extrinsically by reducing defect densities ‐ provides a universal design principle for coercive voltage control. Importantly, nucleation‐limited switching kinetics remain unchanged across the heterostructures, confirming that the enhancement is driven by resistive voltage division rather than trap‐assisted mechanisms. This discovery establishes a straightforward framework for engineering large memory windows using ferroelectric–dielectric heterostructures, thereby enabling multi‐level (TLC/QLC) operation in 3D NAND. Beyond memory applications, our findings also explain the contrasting behaviors of fluorite‐ vs. perovskite‐based ferroelectric–dielectric systems, offering fundamental guidance for interfacial materials design in next‐generation electronic devices.","PeriodicalId":110,"journal":{"name":"Advanced Electronic Materials","volume":"241 1","pages":""},"PeriodicalIF":6.2,"publicationDate":"2026-02-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146122041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Inkjet-Printed Metal Halide Perovskite Thin-Film Field-Effect Transistors 喷墨印刷金属卤化物钙钛矿薄膜场效应晶体管
IF 6.2 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2026-02-04 DOI: 10.1002/aelm.202500517
Claas Wieland, Felix Hermerschmidt, Vincent R. F. Schröder, Daniel Steffen Rühl, Emil J. W. List-Kratochvil
Metal halide perovskites (MHPs) are promising semiconductor materials for thin-film field-effect transistors (FETs) due to their high charge carrier mobility and solution processability. Currently, MHP thin films for FETs are mostly fabricated by spin coating, a method limited by poor material utilization, non-uniformity, and scalability issues. In this study, inkjet-printing (IJP) is successfully introduced as a sustainable, additive technique for MHP thin-film FET fabrication. Spin-coated benchmark devices were first established as a performance reference achieving a mobility of 2.2 cm2 V1 s1 and an on/off ratio of 8 × 106. Two inkjet-based strategies are investigated: full-substrate printing and selective in-channel printing. With the full-substrate printing approach we could achieve 1.6 cm2 V−1 s−1 and an on/off ratio of 2 × 106, which replicates the device performance of the spin coated reference devices. In-channel printing enables full patterning of the FET active region and significantly reduces material waste but suffers from reduced device performance due to the coffee ring effect. By scaling the printed area and effectively isolating the coffee ring, the adverse effects are successfully mitigated, enabling a substantial recovery of device performance. This study highlights the strong potential of IJP for the fabrication of MHP thin-film FETs and provides valuable insights into overcoming current challenges. Overall, the results demonstrate that IJP is a highly promising route toward the scalable production of fully printed, high-performance perovskite electronics.
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引用次数: 0
XHEMTs on Ultrawide Bandgap Single‐Crystal AlN Substrates (Adv. Electron. Mater. 3/2026) 超宽带隙单晶AlN衬底上的XHEMTs板牙。3/2026)
IF 6.2 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2026-02-04 DOI: 10.1002/aelm.70252
Eungkyun Kim, Yu‐Hsin Chen, Naomi Pieczulewski, Jimy Encomendero, David Anthony Muller, Debdeep Jena, Huili Grace Xing
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引用次数: 0
Precise Tailoring of Charge Transport Characteristics in Zr and Hf Doped Indium Tin Oxide Thin Film Transistors Zr和Hf掺杂铟锡氧化物薄膜晶体管中电荷输运特性的精确裁剪
IF 6.2 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2026-02-03 DOI: 10.1002/aelm.202500722
Marie Isabelle Büschges, Christian Dietz, Vanessa Trouillet, Ann-Christin Dippel, Fernando Igoa Saldaña, Jörg J. Schneider
Zirconium and hafnium doped indium tin oxide (ITO) thin films are fabricated via atomic layer deposition (ALD) at 200°C from trimethylindium, tetrakis(dimethylamido)tin, tetrakis(dimethylamido)zirconium, and tetrakis(diethylamido)hafnium, using water as oxidant. Grazing incidence X-ray total scattering employing synchrotron radiation reveals a highly disordered structure with a short-range order, exhibiting correlation lengths of up to ∼13 Å. This is also reflected in high-resolution transmission electron microscopy, revealing an amorphous intermixed state of all constituting components. Increasing amounts of fully coordinated oxygen species with increasing amounts of dopant are evidenced by X-ray photoelectron spectroscopy analysis and attributed to zirconium and hafnium's ability to form strong oxygen bonds, and thereby suppressing the formation of oxygen vacancies. The Zr- and Hf-doped ITO thin films are integrated into thin-film transistor (TFT) devices to evaluate their suitability as semiconducting material. The electrical measurements reveal saturation mobilities (µsat) of 1.92–9.81 cm2 V−1 s−1, with high current on/off ratios (IOn/IOff) of 106–108. This study demonstrates the subtle influence of small amounts of Zr and Hf on TFT performance. This proves the ability to control the electrical behavior of TFT devices by controlled incorporation of dopants like Zr and Hf into their active channel layer.
采用原子层沉积法(ALD),在200℃下,以三甲铟、四(二甲酰胺)锡、四(二甲酰胺)锆和四(二乙基酰胺)铪为原料,以水为氧化剂制备了掺杂锆和掺杂铪的氧化铟锡(ITO)薄膜。采用同步辐射的掠入射x射线全散射揭示了具有短程有序的高度无序结构,显示出高达~ 13 Å的相关长度。这也反映在高分辨率透射电子显微镜下,揭示了所有组成成分的无定形混合状态。x射线光电子能谱分析证明,随着掺杂量的增加,全配位氧的数量也在增加,这归因于锆和铪形成强氧键的能力,从而抑制了氧空位的形成。将掺杂Zr和hf的ITO薄膜集成到薄膜晶体管(TFT)器件中,以评估其作为半导体材料的适用性。电学测量显示饱和迁移率(µsat)为1.92-9.81 cm2 V−1 s−1,高电流通/关比(IOn/IOff)为106-108。本研究证明了少量Zr和Hf对TFT性能的微妙影响。这证明了通过将掺杂剂如Zr和Hf控制到TFT器件的有源沟道层中来控制其电气行为的能力。
{"title":"Precise Tailoring of Charge Transport Characteristics in Zr and Hf Doped Indium Tin Oxide Thin Film Transistors","authors":"Marie Isabelle Büschges, Christian Dietz, Vanessa Trouillet, Ann-Christin Dippel, Fernando Igoa Saldaña, Jörg J. Schneider","doi":"10.1002/aelm.202500722","DOIUrl":"https://doi.org/10.1002/aelm.202500722","url":null,"abstract":"Zirconium and hafnium doped indium tin oxide (ITO) thin films are fabricated via atomic layer deposition (ALD) at 200°C from trimethylindium, tetrakis(dimethylamido)tin, tetrakis(dimethylamido)zirconium, and tetrakis(diethylamido)hafnium, using water as oxidant. Grazing incidence X-ray total scattering employing synchrotron radiation reveals a highly disordered structure with a short-range order, exhibiting correlation lengths of up to ∼13 Å. This is also reflected in high-resolution transmission electron microscopy, revealing an amorphous intermixed state of all constituting components. Increasing amounts of fully coordinated oxygen species with increasing amounts of dopant are evidenced by X-ray photoelectron spectroscopy analysis and attributed to zirconium and hafnium's ability to form strong oxygen bonds, and thereby suppressing the formation of oxygen vacancies. The Zr- and Hf-doped ITO thin films are integrated into thin-film transistor (TFT) devices to evaluate their suitability as semiconducting material. The electrical measurements reveal saturation mobilities (<i>µ<sub>s</sub><sub>at</sub></i>) of 1.92–9.81 cm<sup>2</sup> V<sup>−1 </sup>s<sup>−1</sup>, with high current on/off ratios (<i>I<sub>On</sub>/I<sub>Off</sub></i>) of 10<sup>6</sup>–10<sup>8</sup>. This study demonstrates the subtle influence of small amounts of Zr and Hf on TFT performance. This proves the ability to control the electrical behavior of TFT devices by controlled incorporation of dopants like Zr and Hf into their active channel layer.","PeriodicalId":110,"journal":{"name":"Advanced Electronic Materials","volume":"111 1","pages":""},"PeriodicalIF":6.2,"publicationDate":"2026-02-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146115907","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Interface-Engineered TiO2 Interlayer for Reliable Hafnia-Based MFMIS FeFETs 接口工程TiO2中间层用于可靠的hafnia MFMIS效应管
IF 6.2 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2026-02-02 DOI: 10.1002/aelm.202500767
Changhyeon Han, Been Kwak, Hyun-Min Kim, Dahye Yu, Daewoong Kwon
We investigated a TiO2-engineered interfacial strategy to enhance the stability and reliability of hafnia-based ferroelectric field-effect transistors (FeFETs) employing a metal-ferroelectric-metal-insulator-semiconductor (MFMIS) architecture. Although the MFMIS configuration facilitates optimized voltage distribution and suppresses charge injection into the dielectric layer, interfacial defects—particularly oxygen vacancies (VOs)—at the floating gate/ferroelectric interface continue to degrade switching performance. To address this issue, we introduced an ultrathin TiO2 interlayer between the floating gate (FG) and the ferroelectric layer. Acting as an oxygen reservoir, the TiO2 interlayer effectively mitigates VO formation and stabilizes the interfacial structure. X-ray photoelectron spectroscopy and electron energy loss spectroscopy analyses confirm a reduced concentration of VO at the interface. Consequently, TiO2-inserted MFMIS devices exhibit enlarged and more stable memory windows, along with enhanced ferroelectric characteristics. Furthermore, low-frequency noise analysis reveals a significant reduction in defect-related fluctuations, indicating suppressed trap dynamics. Collectively, these results demonstrate that TiO2 interface engineering offers a scalable and complementary metal-oxide-semiconductor-compatible strategy to address reliability challenges in hafnia-based ferroelectric transistors.
我们研究了一种二氧化钛工程界面策略,以提高采用金属-铁电-金属-绝缘体-半导体(MFMIS)结构的铪基铁电场效应晶体管(fefet)的稳定性和可靠性。尽管MFMIS结构有利于优化电压分布并抑制电荷注入介电层,但浮栅/铁电界面上的界面缺陷,特别是氧空位(VOs)继续降低开关性能。为了解决这个问题,我们在浮栅(FG)和铁电层之间引入了超薄TiO2中间层。TiO2夹层作为储氧层,有效地减缓了VO的形成,稳定了界面结构。x射线光电子能谱和电子能量损失能谱分析证实了界面处VO浓度的降低。因此,二氧化钛插入的MFMIS器件显示出更大和更稳定的记忆窗口,以及增强的铁电特性。此外,低频噪声分析显示缺陷相关波动显著减少,表明抑制陷阱动态。总之,这些结果表明,TiO2界面工程提供了一种可扩展和互补的金属氧化物半导体兼容策略,以解决基于铪的铁电晶体管的可靠性挑战。
{"title":"Interface-Engineered TiO2 Interlayer for Reliable Hafnia-Based MFMIS FeFETs","authors":"Changhyeon Han, Been Kwak, Hyun-Min Kim, Dahye Yu, Daewoong Kwon","doi":"10.1002/aelm.202500767","DOIUrl":"https://doi.org/10.1002/aelm.202500767","url":null,"abstract":"We investigated a TiO<sub>2</sub>-engineered interfacial strategy to enhance the stability and reliability of hafnia-based ferroelectric field-effect transistors (FeFETs) employing a metal-ferroelectric-metal-insulator-semiconductor (MFMIS) architecture. Although the MFMIS configuration facilitates optimized voltage distribution and suppresses charge injection into the dielectric layer, interfacial defects—particularly oxygen vacancies (V<sub>O</sub>s)—at the floating gate/ferroelectric interface continue to degrade switching performance. To address this issue, we introduced an ultrathin TiO<sub>2</sub> interlayer between the floating gate (FG) and the ferroelectric layer. Acting as an oxygen reservoir, the TiO<sub>2</sub> interlayer effectively mitigates V<sub>O</sub> formation and stabilizes the interfacial structure. X-ray photoelectron spectroscopy and electron energy loss spectroscopy analyses confirm a reduced concentration of V<sub>O</sub> at the interface. Consequently, TiO<sub>2</sub>-inserted MFMIS devices exhibit enlarged and more stable memory windows, along with enhanced ferroelectric characteristics. Furthermore, low-frequency noise analysis reveals a significant reduction in defect-related fluctuations, indicating suppressed trap dynamics. Collectively, these results demonstrate that TiO<sub>2</sub> interface engineering offers a scalable and complementary metal-oxide-semiconductor-compatible strategy to address reliability challenges in hafnia-based ferroelectric transistors.","PeriodicalId":110,"journal":{"name":"Advanced Electronic Materials","volume":"95 1","pages":""},"PeriodicalIF":6.2,"publicationDate":"2026-02-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146101935","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reconfigurable, Non-Volatile Switching in WO3 Film for Resistive Memory and Multistate Programming Toward Energy-Efficient Neuromorphic Computing Applications 可重构的、非易失性的WO3薄膜开关,用于电阻式存储器和面向节能神经形态计算应用的多态编程
IF 6.2 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2026-01-30 DOI: 10.1002/aelm.202500658
Keval Hadiyal, Nagarajan Raghavan, Ramesh Mohan Thamankar
Non-volatile memristive device compatible for futuristic memory, data storage and in-memory computing with good exceptional energy efficiency will be an integral part of neuromorphic architecture. Tungsten oxide (<span data-altimg="/cms/asset/71a9cbe0-e4c1-462f-8d89-9f040ea7875e/aelm70293-math-0001.png"></span><mjx-container ctxtmenu_counter="128" ctxtmenu_oldtabindex="1" jax="CHTML" role="application" sre-explorer- style="font-size: 103%; position: relative;" tabindex="0"><mjx-math aria-hidden="true" location="graphic/aelm70293-math-0001.png"><mjx-semantics><mjx-msub data-semantic-children="0,1" data-semantic- data-semantic-role="unknown" data-semantic-speech="upper W upper O 3" data-semantic-type="subscript"><mjx-mi data-semantic-font="normal" data-semantic- data-semantic-parent="2" data-semantic-role="unknown" data-semantic-type="identifier"><mjx-c></mjx-c><mjx-c></mjx-c></mjx-mi><mjx-script style="vertical-align: -0.15em;"><mjx-mn data-semantic-annotation="clearspeak:simple" data-semantic-font="normal" data-semantic- data-semantic-parent="2" data-semantic-role="integer" data-semantic-type="number" size="s"><mjx-c></mjx-c></mjx-mn></mjx-script></mjx-msub></mjx-semantics></mjx-math><mjx-assistive-mml display="inline" unselectable="on"><math altimg="urn:x-wiley:2199160X:media:aelm70293:aelm70293-math-0001" display="inline" location="graphic/aelm70293-math-0001.png" xmlns="http://www.w3.org/1998/Math/MathML"><semantics><msub data-semantic-="" data-semantic-children="0,1" data-semantic-role="unknown" data-semantic-speech="upper W upper O 3" data-semantic-type="subscript"><mi data-semantic-="" data-semantic-font="normal" data-semantic-parent="2" data-semantic-role="unknown" data-semantic-type="identifier">WO</mi><mn data-semantic-="" data-semantic-annotation="clearspeak:simple" data-semantic-font="normal" data-semantic-parent="2" data-semantic-role="integer" data-semantic-type="number">3</mn></msub>${rm WO}_{3}$</annotation></semantics></math></mjx-assistive-mml></mjx-container>) is a versatile metal oxide displaying memristive characteristics where resistance states can be controlled through oxygen vacancy concentration holds great potential for such low energy neuromorphic devices. Here, we report a WO<sub>3</sub> based resistive switching memory device showing exceptional stability in switching with respect to number of dc-switching cycles (<span data-altimg="/cms/asset/c0ae8974-8066-4b49-bfdb-5fc14dfe1380/aelm70293-math-0002.png"></span><mjx-container ctxtmenu_counter="129" ctxtmenu_oldtabindex="1" jax="CHTML" role="application" sre-explorer- style="font-size: 103%; position: relative;" tabindex="0"><mjx-math aria-hidden="true" location="graphic/aelm70293-math-0002.png"><mjx-semantics><mjx-mo data-semantic- data-semantic-role="equality" data-semantic-speech="tilde" data-semantic-type="relation"><mjx-c></mjx-c></mjx-mo></mjx-semantics></mjx-math><mjx-assistive-mml display="inline" unselectable="on"><math altimg="urn:x-wiley:2199160X:media:aelm70
非易失性记忆器件兼容未来存储器、数据存储和内存计算,具有良好的卓越能效,将成为神经形态架构的一个组成部分。氧化钨(WO3 ${rm WO}_{3}$)是一种多用途的金属氧化物,具有忆阻特性,其电阻状态可以通过氧空位浓度来控制,在这种低能神经形态器件中具有很大的潜力。在这里,我们报告了一种基于WO3的电阻开关存储器件,在直流开关周期数(~ $sim$ 12 × $times$ 103 $^{3}$周期)和+0.2 V下保持时间超过5000秒方面表现出卓越的开关稳定性。基于电压应力测量,该器件提供低电压开关操作(+0.72 SET V, -0.12 RESET V),大开/关比(&gt; $>$ 103),低能耗(每事件约$sim$ 2.1 f²J²μ²m−2 $fJ mu m^{-2}$)和动态范围约$sim$ 7。此外,还显示了配对脉冲激发(PPF)和配对脉冲抑制(PPD)等主要突触特征,这表明基于WO3 ${rm WO}_{3}$的器件适用于神经形态学应用。有趣的是,短期记忆(STM)到长期记忆(LTM)之间的过渡被认为是刺激持续时间的函数。使用MNIST数据集,学习和遗忘曲线与图像识别能力表现出很好的线性关系。~ $sim$的识别准确率为88% is achieved with respect to ideal device. This work demonstrates the effective use of WO3 based memristive device for low energy consuming neuromorphic computing applications.
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引用次数: 0
Doping in Organic Semiconductors: Fundamentals, Materials, and Applications 有机半导体中的掺杂:基础、材料和应用
IF 6.2 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Pub Date : 2026-01-30 DOI: 10.1002/aelm.202500846
Sergi Riera-Galindo
<p>The controlled doping of organic semiconductors has emerged as a central research direction in organic electronics, driven by the recognition that precise manipulation of carrier density is essential for fully exploiting the unique properties of these materials. Symposium T at the 2024 Spring Meeting of the European Materials Research Society (E-MRS) underscored the need for a deeper and more unified understanding of these processes. The invited contributions assembled in this Special Issue of <i>Advanced Electronic Materials</i> reflect the significant progress being made toward predictive doping strategies and rational materials design.</p><p>One major theme addressed in this collection is the advancement of n-type doping and its implications for organic thermoelectrics. Several articles demonstrate how molecular structure, regiochemistry, and processing conditions determine the efficiency and stability of n-doped systems. Fullerene derivatives with controlled regiochemistry (202500287) reveal how crystallinity and dopant miscibility influence both conductivity and thermoelectric performance. Benzodifuranone copolymers exhibit greatly enhanced electronic transport when high backbone alignment is combined with sequential doping using N-DMBI-H. (202500047). Structural variations in benzodifuranone–isatin acceptor polymers (202500213) further demonstrate how backbone conformation governs morphology and ultimately thermoelectric behavior. The study of charge injection and transport in isoindigo–bithiophene polymers (202500098) provides insights into how molecular structure governs doped transport in field-effect devices. The contributions (202400988, 202400767) further extend the range of n-type materials and doping strategies by introducing new molecular backbones, dopant–polymer combinations, and process-compatible approaches. Together, these studies advance the understanding and application of n-type doping in organic semiconductors.</p><p>Progress in p-type doping and hybrid transport systems is also well represented. The use of proton-coupled electron transfer enables bandgap-dependent doping in semiconducting carbon nanotube networks (202400817), where the doping level depends on both the chemical environment and the nanotube diameter. Hybrid thermoelectric composites, formed by wrapping semiconducting carbon nanotubes with a p-type polymer (202400216), demonstrate how interfacial design can promote delocalized charge transport. Improvements in dip-coated conjugated polymer films (202400695) show that processing conditions, particularly the Landau–Levich and evaporation regimes, which govern polymer packing and dopant–host interactions, have a decisive influence on thermoelectric performance. Redox-active copolymer films based on vinyl(triphenylamine) and styrene (202500645) provide a model system to study mixed ionic–electronic conduction, where variations in crosslinking density and polymer architecture directly influence reversible re
有机半导体的受控掺杂已经成为有机电子学的一个中心研究方向,这是由于人们认识到精确控制载流子密度对于充分利用这些材料的独特性能至关重要。欧洲材料研究学会(E-MRS) 2024年春季会议的研讨会强调了对这些过程进行更深入和更统一理解的必要性。本期《先进电子材料》特刊的特邀文章反映了在预测掺杂策略和合理材料设计方面取得的重大进展。本系列的一个主要主题是n型掺杂的进展及其对有机热电学的影响。几篇文章展示了分子结构、区域化学和加工条件如何决定n掺杂体系的效率和稳定性。具有可控区域化学的富勒烯衍生物(202500287)揭示了结晶度和掺杂混相如何影响电导率和热电性能。当高骨架排列与N-DMBI-H序贯掺杂相结合时,苯二呋喃酮共聚物的电子输运显著增强。(202500047)。苯二呋喃酮- isatin受体聚合物(202500213)的结构变化进一步证明了主链构象如何控制形态和最终的热电行为。异靛蓝-双噻吩聚合物(202500098)中电荷注入和输运的研究提供了分子结构如何控制场效应器件中掺杂输运的见解。贡献(202400988,202400767)通过引入新的分子骨架,掺杂-聚合物组合和工艺相容方法,进一步扩展了n型材料和掺杂策略的范围。总之,这些研究促进了对n型掺杂在有机半导体中的理解和应用。p型掺杂和混合输运系统的进展也得到了很好的体现。质子耦合电子转移的使用使得半导体碳纳米管网络(202400817)中的带隙依赖掺杂成为可能,其中掺杂水平取决于化学环境和纳米管直径。由p型聚合物(202400216)包裹半导体碳纳米管形成的杂化热电复合材料,展示了界面设计如何促进离域电荷输运。浸渍涂覆共轭聚合物薄膜(202400695)的改进表明,加工条件,特别是控制聚合物填料和掺杂剂-宿主相互作用的朗道-列维奇和蒸发机制,对热电性能有决定性的影响。基于乙烯基(三苯胺)和苯乙烯(202500645)的氧化还原活性共聚物薄膜为研究混合离子-电子传导提供了一个模型系统,其中交联密度和聚合物结构的变化直接影响可逆氧化还原行为、离子吸收和电荷补偿过程。第三组贡献提供了对控制掺杂迁移、相行为和空间分布的微观机制的基本见解。热活化诱导共混聚合物(202500170)中掺杂物的扩散和相偏析,强烈影响掺杂材料的电子结构和稳定性。掺杂共轭聚合物(202400662)的计算显微镜显示了很大程度上随机的掺杂分布,而不是显著的聚类,提供了更真实的掺杂状态表示,并为未来的输运模型提供了信息。本期特刊收录的文章表明,在理解和控制有机半导体中的掺杂方面取得了实质性进展。n型分子设计的进步,混合和复合输运系统的发展,以及对掺杂动力学越来越详细的了解,都指向了对掺杂过程进行更大控制的可能性。这些发展不仅有望实现更稳定、高效和多用途的有机电子设备,而且还将为能量收集、柔性电子和生物集成技术的应用提供新的机会,在这些领域,精确调谐电荷传输是必不可少的。
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引用次数: 0
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Advanced Electronic Materials
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