将磨粒应用于磨削工具底面的静电方法研究

IF 0.8 4区 物理与天体物理 Q4 PHYSICS, APPLIED Technical Physics Letters Pub Date : 2024-06-03 DOI:10.1134/S1063785024700275
D. B. Shatko, V. S. Lyukshin, P. A. Strelnikov
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引用次数: 0

摘要

摘要 本文专门研究了在制造柔性磨具时将磨料涂抹到衬底表面的静电方法问题。文章介绍了一种独创的技术,用于制造磨粒以不同角度定向的实验样品。文中给出了磨粒相对于衬底表面的定向装置图。实验揭示并证实了磨粒定向的最佳角度。文章分析了改变电极间距对磨粒在样品底面集中程度的影响参数。结果显示了不同粒度的取向磨粒占磨粒总数的百分比。确定了倾斜角与背衬单位表面实际磨粒数量之间的关系。根据所获得的统计数据,得出了可用于制造柔性磨具的结论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Study of the Electrostatic Method of Applying Abrasive Grains to the Grinding Tool Backing

The article is devoted to the study of the problem of the electrostatic method of applying abrasive to the surface of the backing when manufacturing flexible grinding tools. An original technique for the manufacture of experimental samples with abrasive grains oriented at various angles is presented in the article. The diagrams of apparatuses for the orientation of grains relative to the backing surface are given. The optimal angle of grain orientation was revealed and substantiated experimentally. The parameter of the influence of changing the distance between the electrodes on the degree of concentration of grains on the backing surface of the samples is analyzed. The percentage ratios of oriented abrasive grains relative to their total number for various grain sizes are presented. The relationship between the angle of inclination and the actual number of grains per unit surface of the backing is determined. Based on the statistical data obtained, conclusions are formulated that can be used in the manufacture of flexible grinding tools.

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来源期刊
Technical Physics Letters
Technical Physics Letters 物理-物理:应用
CiteScore
1.50
自引率
0.00%
发文量
44
审稿时长
2-4 weeks
期刊介绍: Technical Physics Letters is a companion journal to Technical Physics and offers rapid publication of developments in theoretical and experimental physics with potential technological applications. Recent emphasis has included many papers on gas lasers and on lasing in semiconductors, as well as many reports on high Tc superconductivity. The excellent coverage of plasma physics seen in the parent journal, Technical Physics, is also present here with quick communication of developments in theoretical and experimental work in all fields with probable technical applications. Topics covered are basic and applied physics; plasma physics; solid state physics; physical electronics; accelerators; microwave electron devices; holography.
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