尖锐滑动接触下二硅酸锂的脆性-延展阈值

Journal of dental research Pub Date : 2024-07-01 Epub Date: 2024-06-14 DOI:10.1177/00220345241256279
M Bawazir, C H Lim, P Arnés-Urgellés, M Lu, H Huang, Y Zhang
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引用次数: 0

摘要

计算机辅助设计(CAD)/计算机辅助制造(CAM)铣削和手机研磨是制作和调整陶瓷牙科修复体的关键程序。然而,由于微裂纹的形成,这些程序对陶瓷的强度不利。本研究分析了当前脆性机制研磨所造成的损害,并提出了一种潜在的补救措施,即应用一种更安全但仍然有效的研磨机制,即 "韧性机制研磨"。根据制造商的说明,通过切割和结晶偏硅酸锂 CAD/CAM 坯料(即所谓的蓝块),获得了二硅酸锂玻璃陶瓷材料(IPS e.max CAD)的圆盘状试样。然后将圆盘抛光至 1 µm 的金刚石悬浮表面。使用锥形金刚石压头进行单颗粒微划痕测试(n = 10),以再现变形和断裂的基本模式。记录了摩擦系数和穿透深度等关键参数与划痕载荷的函数关系。此外,在施加各种划痕载荷后还进行了双轴挠曲强度测试(n = 6),以分析它们对陶瓷强度的影响。扫描电子显微镜(SEM)和聚焦离子束(FIB)用于表征表面和次表面损伤。统计分析采用单因子方差分析和 Tukey 检验。虽然扫描电子显微镜(SEM)对划痕痕迹的表面分析表明存在韧性和脆性去除模式,但未能准确确定脆性-韧性转变的阈值载荷。根据结合强度退化研究进行的 FIB 表面下损伤分析,脆性-韧性转变的阈值载荷被确定为 70 mN。低于 70 mN 时,试样既不会出现强度下降,也不会形成表面下裂纹。脆性-韧性阈值的确定具有重要意义,因为它为今后研究实施韧性机制研磨/磨削协议以制造无损伤陶瓷牙科修复体的可行性奠定了基础。
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Brittle-Ductile Threshold in Lithium Disilicate under Sharp Sliding Contact.

Computer-aided design (CAD)/computer-aided manufacturing (CAM) milling and handpiece grinding are critical procedures in the fabrication and adjustment of ceramic dental restorations. However, due to the formation of microfractures, these procedures are detrimental to the strength of ceramics. This study analyzes the damage associated with current brittle-regime grinding and presents a potential remedy in the application of a safer yet still efficient grinding regime known as "ductile-regime grinding." Disc-shaped specimens of a lithium disilicate glass-ceramic material (IPS e.max CAD) were obtained by cutting and crystallizing the lithium metasilicate CAD/CAM blanks (the so-called blue blocks) following the manufacturer's instructions. The discs were then polished to a 1 µm diamond suspension finish. Single-particle micro-scratch tests (n = 10) with a conical diamond indenter were conducted to reproduce basic modes of deformation and fracture. Key parameters such as coefficient of friction and penetration depth were recorded as a function of scratch load. Further, biaxial flexure strength tests (n = 6) were performed after applying various scratch loads to analyze their effects on ceramic strength. Scanning electron microscopy (SEM) and focused ion beam (FIB) were used to characterize surface and subsurface damage. Statistical analysis was performed using one-way analysis of variance and Tukey tests. While the SEM surface analysis of scratch tracks revealed the occurrence of both ductile and brittle removal modes, it failed to accurately determine the threshold load for the brittle-ductile transition. The threshold load for brittle-ductile transition was determined to be 70 mN based on FIB subsurface damage analyses in conjunction with strength degradation studies. Below 70 mN, the specimens exhibited neither strength degradation nor the formation of subsurface cracks. Determination of the brittle-ductile thresholds is significant because it sets a foundation for future research on the feasibility of implementing ductile-regime milling/grinding protocols for fabricating damage-free ceramic dental restorations.

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