化学机械抛光用铈的发展综述

IF 4.5 2区 工程技术 Q2 ENGINEERING, CHEMICAL Powder Technology Pub Date : 2024-06-12 DOI:10.1016/j.powtec.2024.119989
Jiahui Ma , Ning Xu , Jie Cheng , Yongping Pu
{"title":"化学机械抛光用铈的发展综述","authors":"Jiahui Ma ,&nbsp;Ning Xu ,&nbsp;Jie Cheng ,&nbsp;Yongping Pu","doi":"10.1016/j.powtec.2024.119989","DOIUrl":null,"url":null,"abstract":"<div><p>Chemical mechanical polishing (CMP) is widely used as an ultra-precision machining technology, which determines the final fabrication accuracy of the device. CeO<sub>2</sub> abrasives exhibit excellent CMP performance due to the unique chemical and mechanical properties. With the increasing demand of planarization, how to improve the polishing efficiency of CeO<sub>2</sub> abrasives in the CMP has become one of the hotspots. Over the past decades, extensive efforts have been devoted to develop the CeO<sub>2</sub> abrasives for CMP and great progress has been obtained. Here, we present an overview on the research of CeO<sub>2</sub> abrasives for CMP. This review starts with a brief introduction the research background and related basic concepts of CMP technology and ceria. Emphasis is placed on the development of CeO<sub>2</sub> abrasives, assisted polishing, CMP mechanism, post-CMP cleaning and computational chemistry. Finally, the future development trend of CeO<sub>2</sub> abrasives and the issues that need to be solved are prospected.</p></div>","PeriodicalId":407,"journal":{"name":"Powder Technology","volume":null,"pages":null},"PeriodicalIF":4.5000,"publicationDate":"2024-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A review on the development of ceria for chemical mechanical polishing\",\"authors\":\"Jiahui Ma ,&nbsp;Ning Xu ,&nbsp;Jie Cheng ,&nbsp;Yongping Pu\",\"doi\":\"10.1016/j.powtec.2024.119989\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Chemical mechanical polishing (CMP) is widely used as an ultra-precision machining technology, which determines the final fabrication accuracy of the device. CeO<sub>2</sub> abrasives exhibit excellent CMP performance due to the unique chemical and mechanical properties. With the increasing demand of planarization, how to improve the polishing efficiency of CeO<sub>2</sub> abrasives in the CMP has become one of the hotspots. Over the past decades, extensive efforts have been devoted to develop the CeO<sub>2</sub> abrasives for CMP and great progress has been obtained. Here, we present an overview on the research of CeO<sub>2</sub> abrasives for CMP. This review starts with a brief introduction the research background and related basic concepts of CMP technology and ceria. Emphasis is placed on the development of CeO<sub>2</sub> abrasives, assisted polishing, CMP mechanism, post-CMP cleaning and computational chemistry. Finally, the future development trend of CeO<sub>2</sub> abrasives and the issues that need to be solved are prospected.</p></div>\",\"PeriodicalId\":407,\"journal\":{\"name\":\"Powder Technology\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":4.5000,\"publicationDate\":\"2024-06-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Powder Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0032591024006326\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, CHEMICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Powder Technology","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0032591024006326","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}
引用次数: 0

摘要

化学机械抛光(CMP)作为一种超精密加工技术被广泛应用,它决定了设备的最终制造精度。CeO2 磨料因其独特的化学和机械性能而表现出优异的 CMP 性能。随着平面化需求的不断增加,如何提高 CeO2 磨料在 CMP 中的抛光效率已成为热点之一。在过去的几十年中,人们一直致力于开发用于 CMP 的 CeO2 磨料,并取得了长足的进步。在此,我们将概述用于 CMP 的 CeO2 磨料的研究情况。综述首先简要介绍了 CMP 技术和铈的研究背景及相关基本概念。重点介绍了 CeO2 磨料的开发、辅助抛光、CMP 机理、CMP 后清洗和计算化学。最后,展望了 CeO2 磨料的未来发展趋势和需要解决的问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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A review on the development of ceria for chemical mechanical polishing

Chemical mechanical polishing (CMP) is widely used as an ultra-precision machining technology, which determines the final fabrication accuracy of the device. CeO2 abrasives exhibit excellent CMP performance due to the unique chemical and mechanical properties. With the increasing demand of planarization, how to improve the polishing efficiency of CeO2 abrasives in the CMP has become one of the hotspots. Over the past decades, extensive efforts have been devoted to develop the CeO2 abrasives for CMP and great progress has been obtained. Here, we present an overview on the research of CeO2 abrasives for CMP. This review starts with a brief introduction the research background and related basic concepts of CMP technology and ceria. Emphasis is placed on the development of CeO2 abrasives, assisted polishing, CMP mechanism, post-CMP cleaning and computational chemistry. Finally, the future development trend of CeO2 abrasives and the issues that need to be solved are prospected.

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来源期刊
Powder Technology
Powder Technology 工程技术-工程:化工
CiteScore
9.90
自引率
15.40%
发文量
1047
审稿时长
46 days
期刊介绍: Powder Technology is an International Journal on the Science and Technology of Wet and Dry Particulate Systems. Powder Technology publishes papers on all aspects of the formation of particles and their characterisation and on the study of systems containing particulate solids. No limitation is imposed on the size of the particles, which may range from nanometre scale, as in pigments or aerosols, to that of mined or quarried materials. The following list of topics is not intended to be comprehensive, but rather to indicate typical subjects which fall within the scope of the journal's interests: Formation and synthesis of particles by precipitation and other methods. Modification of particles by agglomeration, coating, comminution and attrition. Characterisation of the size, shape, surface area, pore structure and strength of particles and agglomerates (including the origins and effects of inter particle forces). Packing, failure, flow and permeability of assemblies of particles. Particle-particle interactions and suspension rheology. Handling and processing operations such as slurry flow, fluidization, pneumatic conveying. Interactions between particles and their environment, including delivery of particulate products to the body. Applications of particle technology in production of pharmaceuticals, chemicals, foods, pigments, structural, and functional materials and in environmental and energy related matters. For materials-oriented contributions we are looking for articles revealing the effect of particle/powder characteristics (size, morphology and composition, in that order) on material performance or functionality and, ideally, comparison to any industrial standard.
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