用于无出血植入的单轴延伸神经探针

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC npj Flexible Electronics Pub Date : 2024-06-14 DOI:10.1038/s41528-024-00323-1
Xueyang Ren, Wen Bai, Shisheng Chen, Yuehui Yuan, Xiaodong Shao, Xuefei Zhu, Li Wang, Qin Jiang, Benhui Hu
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引用次数: 0

摘要

植入式神经探针对脑电生理研究至关重要,其超柔性设计可减轻免疫反应和术后并发症。穿梭辅助植入和临时加固策略解决了将这些探针穿入靶区的问题,避免了不必要的弯曲。然而,由于这些植入物在插入过程中需要一定的硬度,术中出血的风险依然存在。在这里,我们描述了一种具有机械顺应性的神经探针,它能在不出血的情况下沿着主轴进行自我植入。这种行为的关键在于它的各向异性松弛,其主要原因是全局排列的聚合物系统中平行骨架之间的链间相互作用导致的横截面平面内变形抑制。我们使用双光子显微镜和高速相机观察了探针直立插入大脑的情况,同时避免了血管畸变。这种探针可进行电生理研究,异物反应极小,且与图像兼容,突出了其临床应用潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Uniaxial extending neural probes for bleeding-absent implantation
Implantable neural probes, essential for brain electrophysiological research, have advanced with ultra-flexible designs to mitigate immune responses and postoperative complications. Strategies of shuttle-assisted implantation and temporary stiffening address issues in penetrating these probes into the target region, avoiding undesired bending. However, the risk of intraoperative bleeding remains due to these implants’ necessary rigidity during insertion. Here, we describe a neural probe with mechanical compliance accompanying self-implantation along the principal axis in the absence of bleeding. Crucial to the behavior is its anisotropic relaxation, which is dominated by the cross-sectional in-plane deformation inhibition due to interchain interactions between the parallel backbones in the globally aligned polymer system. We observed the ensured upright insertion of the probe into the brain while avoiding angiorrhexis with a two-photon microscope and a high-speed camera. The probes permit electrophysiological studies with minimal foreign body responses and imageological compatibility, underscoring their clinical potential.
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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