探索沉积在 Si(100)基底上的退火 Co40Fe40Dy20 薄膜的表面粗糙度、表面能、纳米压痕、电特性和磁特性之间的相关性

IF 2.8 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Materials Pub Date : 2024-06-15 DOI:10.1007/s11664-024-11237-z
Wen-Jen Liu, Yung-Huang Chang, Shuo-Ting Hsu, Chi-Lon Fern, Yuan-Tsung Chen, Shin-Ying Tsao, Shih-Hung Lin
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引用次数: 0

摘要

研究了薄膜厚度和退火温度对沉积在Si(100)衬底上的钴铁镝(Co40Fe40Dy20)薄膜结构、电、磁和力学性能的影响。x射线衍射(XRD)分析证实了薄膜的晶体微观结构,具有氧化镝,Dy2O3(440),氧化钴,Co2O3(422)和Co2O3(511)的晶体相。表面能测量表明,退火处理后表面能显著降低,这可能归因于残余应力的减轻和原子排列的增强,从而使表面能降低的膜结构更稳定。薄膜硬度随厚度的增加呈下降趋势,薄膜电阻率随厚度和退火温度的变化有显著的响应。值得注意的是,Co40Fe40Dy20薄膜表现出优异的特性,具有675 emu/cm3的高饱和磁化强度和9.5 Oe的低矫顽力。进一步分析磁畴和磁滞回线,发现磁畴越大越亮,Hc越高。综上所述,CoFeDy薄膜在不同退火温度下的表面粗糙度对其磁性、电学、粘附性和光学特性的形成起着关键作用。通过表面平滑使畴壁的钉钉效应最小化,提高了低频交流磁化率(χac)值。此外,光滑的表面显示出更高的载流子导电性,导致电阻降低。总体而言,Co40Fe40Dy20薄膜表现出优异的软磁性能,包括高饱和磁化强度、低矫顽力、优异的机械性能和降低的表面能。图形抽象
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Exploring the Correlation Between Surface Roughness, Surface Energy, Nano-indentation, Electrical Properties, and Magnetic Characteristics of Annealed Co40Fe40Dy20 Thin Films Deposited on Si(100) Substrates

The impact of film thickness and annealing temperature on the structural, electrical, magnetic, and mechanical properties of cobalt–iron–dysprosium (Co40Fe40Dy20 ) thin films deposited on Si(100) substrates have been investigated. X-ray diffraction (XRD) analysis confirmed the film's crystalline microstructure, featuring dysprosium oxide, Dy2O3(440), and cobalt oxide, Co2O3(422) and Co2O3(511), crystallographic phases. Surface energy measurements indicated a noticeable reduction in surface energy following annealing treatments, which could be ascribed to the alleviation of residual stress and enhanced atomic arrangement, resulting in a more stable film structure with reduced surface energy. The film exhibited a decreasing trend in hardness with increasing thickness, and film resistivity was significantly responsive to alterations in thickness and annealing temperature. Notably, the Co40Fe40Dy20 film demonstrated exceptional characteristics, featuring a high saturation magnetization (Ms) of 675 emu/cm3 and a low coercivity (Hc) of 9.5 Oe. Further analysis of magnetic domains and hysteresis loops revealed that larger and brighter domains were associated with higher Hc. To sum up, the surface roughness of CoFeDy films under various annealing temperatures played a pivotal role in shaping their magnetic, electrical, adhesive, and optical characteristics. An improved low-frequency alternating current magnetic susceptibility (χac) value was achieved by minimizing the pinning effect on domain walls through surface smoothing. Moreover, smoother surfaces displayed heightened carrier conductivity, resulting in a decrease in electrical resistance. On the whole, Co40Fe40Dy20 films exhibited outstanding soft magnetic properties, encompassing high saturation magnetization, low coercivity, exceptional mechanical attributes, and decreased surface energy.

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来源期刊
Journal of Electronic Materials
Journal of Electronic Materials 工程技术-材料科学:综合
CiteScore
4.10
自引率
4.80%
发文量
693
审稿时长
3.8 months
期刊介绍: The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications. Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field. A journal of The Minerals, Metals & Materials Society.
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