最小化化学添加剂的铜电镀工艺模拟新模型

{"title":"最小化化学添加剂的铜电镀工艺模拟新模型","authors":"Mingi Kim, Jong Hyuk Bae, S. Bai","doi":"10.1007/s12541-024-01056-x","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":14359,"journal":{"name":"International Journal of Precision Engineering and Manufacturing","volume":null,"pages":null},"PeriodicalIF":1.9000,"publicationDate":"2024-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Novel Model for Copper Electroplating Process Simulation Minimizing Chemical Additives\",\"authors\":\"Mingi Kim, Jong Hyuk Bae, S. Bai\",\"doi\":\"10.1007/s12541-024-01056-x\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":14359,\"journal\":{\"name\":\"International Journal of Precision Engineering and Manufacturing\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.9000,\"publicationDate\":\"2024-06-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Precision Engineering and Manufacturing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1007/s12541-024-01056-x\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Precision Engineering and Manufacturing","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/s12541-024-01056-x","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"Engineering","Score":null,"Total":0}