通过光敏聚酰亚胺实现高性能、独立式柔性薄膜掩膜,用于创建任意表面微图案

FlexMat Pub Date : 2024-06-04 DOI:10.1002/flm2.18
Xuan Dong, Siew Yin Chan, Ruoqing Zhao, Lei Luo, Manzhang Xu, Jiuwei Gao, Xin Ju, Jing Wu, Dongzhi Chi, Xian Jun Loh, Xuewen Wang
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摘要

鉴于复杂表面的广泛存在,电子技术的发展对能够创建精细或新颖图案的表面图案技术产生了巨大需求。然而,目前的表面图案技术存在工艺复杂、分辨率有限、条件苛刻和制造成本高等问题。在此,我们提出了一种使用光敏聚酰亚胺(PSPI)进行任意表面微图案化的新方法,无需图案转移过程即可实现电极的原位制造。在此基础上,我们实现了一种高性能、独立式柔性薄膜掩膜,它具有高光学透明度,便于将微电极图案与目标材料精确对准。它还具有适合长期使用和高温应用的优异机械性能,玻璃化转变温度高达 300°C。制作的掩膜厚度为 5-20 μm,非常适合高分辨率应用,包括要求 5 μm 以下分辨率的应用。此外,利用制作的 PSPI 掩膜在各种表面上创建微电极的工作也已成功完成。我们的简便方法为在复杂表面上实现高效微图案化以制造高性能柔性电子器件奠定了坚实的基础。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Implementation of high-performance, freestanding flexible film masks through photosensitive polyimide for arbitrary surface micropatterns creation

Given the widespread presence of intricate surfaces, the development of electronics has generated a significant demand for surface patterning techniques capable of creating refined or novel patterns. Nevertheless, present surface patterning techniques suffer from complex processes, limited resolution, stringent conditions, and high manufacturing costs. Herein, we present a novel approach for arbitrary surface micropatterning using photosensitive polyimide (PSPI), enabling the in situ fabrication of electrodes without the need for a pattern-transferring process. On this basis, we have implemented a high-performance, freestanding flexible thin-film mask with high optical transparency that facilitates precise alignment of microelectrode patterns with the target material. It also exhibits exceptional mechanical properties suitable for long-term use and high-temperature applications, with a notable glass transition temperature of up to 300°C. The fabricated masks with thicknesses of 5–20 μm are well-suited for high-resolution applications, including those requiring sub-5 μm resolution. Furthermore, the creation of microelectrodes on a variety of surfaces utilizing the fabricated PSPI masks was successfully demonstrated. Our facile method provides a solid foundation for achieving efficient micropatterning for the fabrication of high-performance flexible electronics on complex surfaces.

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