Parametric study in pool boiling enhancement with self-induced jet impingement on sandblasted pin-fin surfaces using R1336mzz(Z)

Enhancing pool boiling performance is crucial for cooling high-power electronics. Inspired by the concept of liquid-vapor separation, we have developed a self-induced jet impingement device to enhance pool boiling, achieving notable results when combined with microporous copper surfaces in subsequent studies. This paper focuses on using sandblasted pin-fin surfaces as heating surfaces and explores their pool boiling performance under varied pin-fin and self-induced jet device parameters. Findings indicate that the self-induced jet device effectively mitigates the obstruction caused by nucleating bubbles to liquid replenishment, leading to improved q_CHF and h_NB@CHF performance compared to standard conditions. The impact of pin-fin sidewall characteristics, determined by the manufacturing process and parameters, is significant, particularly in enhancing boiling heat transfer performance for dielectric liquid cooling processes. Pool boiling performance is negatively affected by too short or too tall pin-fin heights, irrespective of the self-induced jet presence. Simple strategies like increasing guidance tube length or jet holes number are inadequate for enhancing q_CHF. However, increasing the number of jet holes with strategically placing it between pin-fins could still improve boiling performance. This study demonstrates q_CHF enhancements of up to 145.8%, achieving a q_CHF of 61.2 W/cm², which noticeably surpasses standard pool boiling conditions.