Kyeonggon Choi, Seung-Wook Kim, Jae-Hyoung Lee, Baojin Chu, Dae-Yong Jeong
{"title":"用于微机电系统应用的环保型玻璃湿法蚀刻:综述","authors":"Kyeonggon Choi, Seung-Wook Kim, Jae-Hyoung Lee, Baojin Chu, Dae-Yong Jeong","doi":"10.1111/jace.19961","DOIUrl":null,"url":null,"abstract":"<p>Glass is one of the most essential materials in various industrial fields. A representative application is as interposers in the semiconductor and display industries and microfluidic devices in the bio-industry. Due to technological advancements, electric devices and various products are becoming lighter and smaller. Consequently, precision processing of the substrate is becoming increasingly important. One significant leading technology among these is through glass via (TGV) technology, which is attracting attention as a future alternative to through silicon via. In particular, TGV should be capable of microfabrication with a large aspect ratio and a consistent small hole size. TGV is typically fabricated using a wet etching process, so wet etching technology is a prominent focus in microfabrication. However, glass has isotropic properties, making achieving a high aspect ratio difficult. Traditionally, research on the wet etching method using hydrofluoric acid (HF) has been conducted. Nevertheless, HF etching has several disadvantages, including air pollution and human harm. Additional studies have been performed to address these issues. This review paper will cover the conventional HF-based wet etching method and alternative HF etching processes (eco-friendly materials). This technology would significantly help overcome the traditional problems associated with HF etching and fabricating precision-processed glass in the semiconductor, display, and bio-device industries.</p>","PeriodicalId":200,"journal":{"name":"Journal of the American Ceramic Society","volume":null,"pages":null},"PeriodicalIF":3.5000,"publicationDate":"2024-07-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1111/jace.19961","citationCount":"0","resultStr":"{\"title\":\"Eco-friendly glass wet etching for MEMS application: A review\",\"authors\":\"Kyeonggon Choi, Seung-Wook Kim, Jae-Hyoung Lee, Baojin Chu, Dae-Yong Jeong\",\"doi\":\"10.1111/jace.19961\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>Glass is one of the most essential materials in various industrial fields. A representative application is as interposers in the semiconductor and display industries and microfluidic devices in the bio-industry. Due to technological advancements, electric devices and various products are becoming lighter and smaller. Consequently, precision processing of the substrate is becoming increasingly important. One significant leading technology among these is through glass via (TGV) technology, which is attracting attention as a future alternative to through silicon via. In particular, TGV should be capable of microfabrication with a large aspect ratio and a consistent small hole size. TGV is typically fabricated using a wet etching process, so wet etching technology is a prominent focus in microfabrication. However, glass has isotropic properties, making achieving a high aspect ratio difficult. Traditionally, research on the wet etching method using hydrofluoric acid (HF) has been conducted. Nevertheless, HF etching has several disadvantages, including air pollution and human harm. Additional studies have been performed to address these issues. This review paper will cover the conventional HF-based wet etching method and alternative HF etching processes (eco-friendly materials). This technology would significantly help overcome the traditional problems associated with HF etching and fabricating precision-processed glass in the semiconductor, display, and bio-device industries.</p>\",\"PeriodicalId\":200,\"journal\":{\"name\":\"Journal of the American Ceramic Society\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":3.5000,\"publicationDate\":\"2024-07-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://onlinelibrary.wiley.com/doi/epdf/10.1111/jace.19961\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of the American Ceramic Society\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://onlinelibrary.wiley.com/doi/10.1111/jace.19961\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, CERAMICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of the American Ceramic Society","FirstCategoryId":"88","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1111/jace.19961","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}
Eco-friendly glass wet etching for MEMS application: A review
Glass is one of the most essential materials in various industrial fields. A representative application is as interposers in the semiconductor and display industries and microfluidic devices in the bio-industry. Due to technological advancements, electric devices and various products are becoming lighter and smaller. Consequently, precision processing of the substrate is becoming increasingly important. One significant leading technology among these is through glass via (TGV) technology, which is attracting attention as a future alternative to through silicon via. In particular, TGV should be capable of microfabrication with a large aspect ratio and a consistent small hole size. TGV is typically fabricated using a wet etching process, so wet etching technology is a prominent focus in microfabrication. However, glass has isotropic properties, making achieving a high aspect ratio difficult. Traditionally, research on the wet etching method using hydrofluoric acid (HF) has been conducted. Nevertheless, HF etching has several disadvantages, including air pollution and human harm. Additional studies have been performed to address these issues. This review paper will cover the conventional HF-based wet etching method and alternative HF etching processes (eco-friendly materials). This technology would significantly help overcome the traditional problems associated with HF etching and fabricating precision-processed glass in the semiconductor, display, and bio-device industries.
期刊介绍:
The Journal of the American Ceramic Society contains records of original research that provide insight into or describe the science of ceramic and glass materials and composites based on ceramics and glasses. These papers include reports on discovery, characterization, and analysis of new inorganic, non-metallic materials; synthesis methods; phase relationships; processing approaches; microstructure-property relationships; and functionalities. Of great interest are works that support understanding founded on fundamental principles using experimental, theoretical, or computational methods or combinations of those approaches. All the published papers must be of enduring value and relevant to the science of ceramics and glasses or composites based on those materials.
Papers on fundamental ceramic and glass science are welcome including those in the following areas:
Enabling materials for grand challenges[...]
Materials design, selection, synthesis and processing methods[...]
Characterization of compositions, structures, defects, and properties along with new methods [...]
Mechanisms, Theory, Modeling, and Simulation[...]
JACerS accepts submissions of full-length Articles reporting original research, in-depth Feature Articles, Reviews of the state-of-the-art with compelling analysis, and Rapid Communications which are short papers with sufficient novelty or impact to justify swift publication.