Yichen Zhang;Chaowei Tang;Yanqi Zheng;Xian Tang;Ka Nang Leung
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An Adaptive Zero-Current Detector for Single-Inductor Multiple-Output DC-DC Converter With Full-Wave Current Sensor
This brief presents an adaptive zero-current detector (ZCD) for the single-inductor multiple-output (SIMO) DC-DC converter with a full-wave current sensor. The innovative adaptive ZCD, which can be applied to the order power distribution control (OPDC) SIMO DC-DC converter, is designed, and it can accurately turn off the low-side power switch when the SIMO DC-DC converter operates in the discontinuous conduction mode. Besides, a new full-wave current sensor which contains only one sensing transistor is presented, and it can precisely sense the inductor current with a small delay. The SIMO DC-DC converter is designed and fabricated in a standard 65 nm CMOS process with output power ranges from 3.7 to 925 mW. The measured reverse current is reduced by up to 78.2%, and the measured light-load power efficiency is improved by up to 10%.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.