{"title":"氧化锌-二氧化硅薄膜的电子传输性能研究:晶界屏障的构建","authors":"Yidong Zhang","doi":"10.1108/mi-02-2024-0029","DOIUrl":null,"url":null,"abstract":"<h3>Purpose</h3>\n<p>The purpose of this study is to adjust the electronic transport performance of zinc oxide–silicon dioxide (ZnO-SiO<sub>2</sub>) film by the construction of a grain boundary barrier.</p><!--/ Abstract__block -->\n<h3>Design/methodology/approach</h3>\n<p>ZnO-SiO<sub>2</sub> thin films were prepared on glass substrates by a simple sol-gel method. The crystal structure of ZnO and ZnO-SiO<sub>2</sub> powders were tested by X-ray diffraction with copper (Cu) Kα radiation. The absorption spectra of ZnO and ZnO-SiO<sub>2</sub> films were recorded by a ultraviolet-visible spectrophotometer. The micro electrical transport performance of ZnO-SiO<sub>2</sub> thin films were investigated by conductive atomic force microscope and electrostatic force microscope.</p><!--/ Abstract__block -->\n<h3>Findings</h3>\n<p>The results show that the current of ZnO-SiO<sub>2</sub> film decrease, indicating that the mobility of ZnO-SiO<sub>2</sub> film is greatly decreased, owing to the formation of the grain boundary barrier between ZnO and SiO<sub>2</sub>. The phase variation of ZnO-SiO<sub>2</sub> film increases due to the electron accumulation at grain boundaries.</p><!--/ Abstract__block -->\n<h3>Originality/value</h3>\n<p>ZnO and ZnO-5SiO<sub>2</sub> thin films prepared on glass substrates by a simple sol-gel method were first studied by CAFM and EFM. The band gaps of ZnO and ZnO-5SiO<sub>2</sub> is ∼3.05 eV and 3.15 eV, respectively. The barrier height of ZnO-5SiO<sub>2</sub> film increased by ∼0.015 eV after introducing SiO<sub>2</sub>. The phase variation intensity increased to a certain extent after doping SiO<sub>2</sub>, due to the increased GB barrier. ZnO-5SiO<sub>2</sub> film will be a promising ETL candidate in the application of QLEDs field.</p><!--/ Abstract__block -->","PeriodicalId":49817,"journal":{"name":"Microelectronics International","volume":"20 1","pages":""},"PeriodicalIF":0.7000,"publicationDate":"2024-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Study of the electronic transport performance of ZnO-SiO2 film: the construction of grain boundary barrier\",\"authors\":\"Yidong Zhang\",\"doi\":\"10.1108/mi-02-2024-0029\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<h3>Purpose</h3>\\n<p>The purpose of this study is to adjust the electronic transport performance of zinc oxide–silicon dioxide (ZnO-SiO<sub>2</sub>) film by the construction of a grain boundary barrier.</p><!--/ Abstract__block -->\\n<h3>Design/methodology/approach</h3>\\n<p>ZnO-SiO<sub>2</sub> thin films were prepared on glass substrates by a simple sol-gel method. The crystal structure of ZnO and ZnO-SiO<sub>2</sub> powders were tested by X-ray diffraction with copper (Cu) Kα radiation. The absorption spectra of ZnO and ZnO-SiO<sub>2</sub> films were recorded by a ultraviolet-visible spectrophotometer. The micro electrical transport performance of ZnO-SiO<sub>2</sub> thin films were investigated by conductive atomic force microscope and electrostatic force microscope.</p><!--/ Abstract__block -->\\n<h3>Findings</h3>\\n<p>The results show that the current of ZnO-SiO<sub>2</sub> film decrease, indicating that the mobility of ZnO-SiO<sub>2</sub> film is greatly decreased, owing to the formation of the grain boundary barrier between ZnO and SiO<sub>2</sub>. The phase variation of ZnO-SiO<sub>2</sub> film increases due to the electron accumulation at grain boundaries.</p><!--/ Abstract__block -->\\n<h3>Originality/value</h3>\\n<p>ZnO and ZnO-5SiO<sub>2</sub> thin films prepared on glass substrates by a simple sol-gel method were first studied by CAFM and EFM. The band gaps of ZnO and ZnO-5SiO<sub>2</sub> is ∼3.05 eV and 3.15 eV, respectively. The barrier height of ZnO-5SiO<sub>2</sub> film increased by ∼0.015 eV after introducing SiO<sub>2</sub>. The phase variation intensity increased to a certain extent after doping SiO<sub>2</sub>, due to the increased GB barrier. ZnO-5SiO<sub>2</sub> film will be a promising ETL candidate in the application of QLEDs field.</p><!--/ Abstract__block -->\",\"PeriodicalId\":49817,\"journal\":{\"name\":\"Microelectronics International\",\"volume\":\"20 1\",\"pages\":\"\"},\"PeriodicalIF\":0.7000,\"publicationDate\":\"2024-07-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics International\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1108/mi-02-2024-0029\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics International","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1108/mi-02-2024-0029","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Study of the electronic transport performance of ZnO-SiO2 film: the construction of grain boundary barrier
Purpose
The purpose of this study is to adjust the electronic transport performance of zinc oxide–silicon dioxide (ZnO-SiO2) film by the construction of a grain boundary barrier.
Design/methodology/approach
ZnO-SiO2 thin films were prepared on glass substrates by a simple sol-gel method. The crystal structure of ZnO and ZnO-SiO2 powders were tested by X-ray diffraction with copper (Cu) Kα radiation. The absorption spectra of ZnO and ZnO-SiO2 films were recorded by a ultraviolet-visible spectrophotometer. The micro electrical transport performance of ZnO-SiO2 thin films were investigated by conductive atomic force microscope and electrostatic force microscope.
Findings
The results show that the current of ZnO-SiO2 film decrease, indicating that the mobility of ZnO-SiO2 film is greatly decreased, owing to the formation of the grain boundary barrier between ZnO and SiO2. The phase variation of ZnO-SiO2 film increases due to the electron accumulation at grain boundaries.
Originality/value
ZnO and ZnO-5SiO2 thin films prepared on glass substrates by a simple sol-gel method were first studied by CAFM and EFM. The band gaps of ZnO and ZnO-5SiO2 is ∼3.05 eV and 3.15 eV, respectively. The barrier height of ZnO-5SiO2 film increased by ∼0.015 eV after introducing SiO2. The phase variation intensity increased to a certain extent after doping SiO2, due to the increased GB barrier. ZnO-5SiO2 film will be a promising ETL candidate in the application of QLEDs field.
期刊介绍:
Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:
• Advanced packaging
• Ceramics
• Chip attachment
• Chip on board (COB)
• Chip scale packaging
• Flexible substrates
• MEMS
• Micro-circuit technology
• Microelectronic materials
• Multichip modules (MCMs)
• Organic/polymer electronics
• Printed electronics
• Semiconductor technology
• Solid state sensors
• Thermal management
• Thick/thin film technology
• Wafer scale processing.