氮气中常压介质阻挡层放电的光学发射特征:聚四氟乙烯蚀刻过程中的 CN 发射演变

IF 2.9 3区 物理与天体物理 Q2 PHYSICS, APPLIED Plasma Processes and Polymers Pub Date : 2024-07-08 DOI:10.1002/ppap.202400036
Alex Destrieux, Williams M. Caceres Ferreira, Zachary Costantino, Jacopo Profili, Gaetan Laroche
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引用次数: 0

摘要

本研究使用氮气中的常压介质阻挡放电技术,以丝状方式研究了聚四氟乙烯(PTFE)涂层薄膜的蚀刻问题。针对不同的处理持续时间,记录了随时间变化的光学发射光谱。大部分发射归因于 N2 第二正向系统。此外,还观察到 CN 的存在,其发射随着 PTFE 暴露时间的延长而上升。这种上升归因于产生的 CN 的密度。X 射线光电子能谱表面特性分析表明存在两种蚀刻机制。这与氯化萘光学发射强度演变斜率的变化有关。在较长的时间内,电极上会出现含氟沉积物,这证实了蚀刻材料的不同性质。
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Optical emission characterization of an atmospheric pressure dielectric barrier discharge in nitrogen: Evolution of CN emissions during PTFE etching
The present work investigates the etching of coated polytetrafluoroethylene (PTFE) films using an atmospheric pressure dielectric barrier discharge operating in nitrogen in a filamentary regime. For different treatment durations, the optical emission spectra were recorded over time. Most of the emissions are attributed to the N2 second positive system. The presence of CN is also observed, and its emissions rise with the exposure time of PTFE. This rise is attributed to the density of CN produced. The X‐ray photoelectron spectroscopy surface characterization suggests two etching regimes. This is linked with a change in slope in the intensity evolution of the optical emissions of the CN. At longer times, a fluorinated deposit on the electrode is observed, confirming a different nature of the etched material.
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来源期刊
Plasma Processes and Polymers
Plasma Processes and Polymers 物理-高分子科学
CiteScore
6.60
自引率
11.40%
发文量
150
审稿时长
3 months
期刊介绍: Plasma Processes & Polymers focuses on the interdisciplinary field of low temperature plasma science, covering both experimental and theoretical aspects of fundamental and applied research in materials science, physics, chemistry and engineering in the area of plasma sources and plasma-based treatments.
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