更正:钴对 Sn58Bi/Cu 焊点热老化的影响:IMC 生长和机械性能变化

IF 3.3 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Metals and Materials International Pub Date : 2024-07-13 DOI:10.1007/s12540-024-01747-0
Xi Huang, Liang Zhang, Li-bin Rao, Lei Sun
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Correction: Impact of Co on Thermal Aging in Sn58Bi/Cu Solder Joints: IMC Growth and Transformation in Mechanical Properties
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来源期刊
Metals and Materials International
Metals and Materials International 工程技术-材料科学:综合
CiteScore
7.10
自引率
8.60%
发文量
197
审稿时长
3.7 months
期刊介绍: Metals and Materials International publishes original papers and occasional critical reviews on all aspects of research and technology in materials engineering: physical metallurgy, materials science, and processing of metals and other materials. Emphasis is placed on those aspects of the science of materials that are concerned with the relationships among the processing, structure and properties (mechanical, chemical, electrical, electrochemical, magnetic and optical) of materials. Aspects of processing include the melting, casting, and fabrication with the thermodynamics, kinetics and modeling.
期刊最新文献
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