各种光伏阵列连接类型的电气故障和可靠性分析

IF 5.1 2区 工程技术 Q1 ENGINEERING, MULTIDISCIPLINARY Engineering Science and Technology-An International Journal-Jestech Pub Date : 2024-07-20 DOI:10.1016/j.jestch.2024.101774
Emre Avci
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引用次数: 0

摘要

随着人们对太阳能的兴趣与日俱增,各种连接类型应运而生,旨在提高光伏系统在不同环境条件下的效率。解决与这些连接类型相关的挑战对于提高太阳能利用的可靠性至关重要。因此,不同阵列配置的光伏系统中电气故障的重要性日益凸显。本研究的目的是在基于 TMS320F28338 DSP 套件的处理器在环 (PIL) 平台上,利用串并联 (SP)、全并联 (TCT)、桥连 (BL)、蜂巢 (HC)、SP-TCT、BL-TCT、BL-HC 和 HC-TCT 光伏阵列连接类型,全面评估线对不同线 (LDL)、线对线 (LL) 和线对中性线 (LN) 电气故障类型。为此,根据阵列的故障电流和发电功率,定义并计算了所有可能故障类型的可靠性指数 (RI) 和效率指数 (EI)。此外,还正式确定了八种配置类型的系统在不同故障条件下的电流路径。这样,就可以利用所提出的方法轻松分析任意维度光伏阵列的电气故障状态,同时也有助于对未来提出的新光伏配置进行电气故障分析。研究结果表明,在八种配置中,TCT 在所有电气故障类型下的 RI 值最高,为 3.59。相比之下,SP 配置的 RI 值最低,仅为 1.28。相反,SP 阵列配置的平均 EI 明显更高,达到 81.86%,而 TCT 配置的 EI 最低,仅为 56.56%。这表明,在电气故障情况下,TCT 配置最可靠;但 SP 配置的效率最高。此外,在三种电气故障类型中,LN 故障导致几乎所有连接类型的 RI 和 EI 下降更多。
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Electrical fault and reliability analysis of various PV array connection types

The increasing interest in solar energy has led to the development of various connection types designed to enhance the efficiency of photovoltaic (PV) systems under different environmental conditions. Addressing the challenges associated with these connection types is crucial for improving the reliability of solar energy utilization. Accordingly, the significance of electrical faults in PV systems with different array configurations has grown. This study aims to comprehensively evaluate Line-to-Different Line (LDL), Line-to-Line (LL), and Line-to-Neutral (LN) electrical fault types using the Series–Parallel (SP), Total-Cross-Tie (TCT), Bridge-Link (BL), Honey-Comb (HC), SP-TCT, BL-TCT, BL-HC, and HC-TCT PV array connection types on the TMS320F28338 DSP kit based Processor-in-Loop (PIL) platform. To do this, The Reliability Index (RI) and Efficiency Index (EI) are defined and calculated for all possible fault types based on the array’s fault current and generated power. Additionally, the current paths of the system under different fault conditions for eight configuration types are formalized. With this, the electrical fault states of a PV array in any dimension can be easily analyzed with the proposed method, and it will also facilitate the electrical fault analysis of a new PV configuration to be proposed in the future. The results of this work indicate that among the eight configurations, the TCT achieves the highest RI value of 3.59 under all electrical fault types. In contrast, the SP configuration has the lowest RI of 1.28. Conversely, the SP array configuration shows a significantly higher average EI of 81.86%, while the TCT configuration has the lowest EI of 56.56%. These indicate that the TCT configuration is the most reliable under electrical faults; however, the SP configuration is the most efficient. In addition, among the three electrical fault types, the LN fault causes more deterioration in the RI and EI across almost all connection types.

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来源期刊
Engineering Science and Technology-An International Journal-Jestech
Engineering Science and Technology-An International Journal-Jestech Materials Science-Electronic, Optical and Magnetic Materials
CiteScore
11.20
自引率
3.50%
发文量
153
审稿时长
22 days
期刊介绍: Engineering Science and Technology, an International Journal (JESTECH) (formerly Technology), a peer-reviewed quarterly engineering journal, publishes both theoretical and experimental high quality papers of permanent interest, not previously published in journals, in the field of engineering and applied science which aims to promote the theory and practice of technology and engineering. In addition to peer-reviewed original research papers, the Editorial Board welcomes original research reports, state-of-the-art reviews and communications in the broadly defined field of engineering science and technology. The scope of JESTECH includes a wide spectrum of subjects including: -Electrical/Electronics and Computer Engineering (Biomedical Engineering and Instrumentation; Coding, Cryptography, and Information Protection; Communications, Networks, Mobile Computing and Distributed Systems; Compilers and Operating Systems; Computer Architecture, Parallel Processing, and Dependability; Computer Vision and Robotics; Control Theory; Electromagnetic Waves, Microwave Techniques and Antennas; Embedded Systems; Integrated Circuits, VLSI Design, Testing, and CAD; Microelectromechanical Systems; Microelectronics, and Electronic Devices and Circuits; Power, Energy and Energy Conversion Systems; Signal, Image, and Speech Processing) -Mechanical and Civil Engineering (Automotive Technologies; Biomechanics; Construction Materials; Design and Manufacturing; Dynamics and Control; Energy Generation, Utilization, Conversion, and Storage; Fluid Mechanics and Hydraulics; Heat and Mass Transfer; Micro-Nano Sciences; Renewable and Sustainable Energy Technologies; Robotics and Mechatronics; Solid Mechanics and Structure; Thermal Sciences) -Metallurgical and Materials Engineering (Advanced Materials Science; Biomaterials; Ceramic and Inorgnanic Materials; Electronic-Magnetic Materials; Energy and Environment; Materials Characterizastion; Metallurgy; Polymers and Nanocomposites)
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