同步提高带宽和灵敏度的 JMEMS Letters.1pt 等维压电微机械超声波换能器阵列

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Microelectromechanical Systems Pub Date : 2024-07-18 DOI:10.1109/JMEMS.2024.3425956
Xingli Xu;Yuewu Gong;Zhuochen Wang;Yongquan Ma;Chenyang Yu;Wei Wei;Pengfei Niu;Wei Pang
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引用次数: 0

摘要

增强 PMUT 阵列带宽(BW)的常见方法可能会影响灵敏度和填充因子。本研究引入了一种新型 PMUT 阵列,该阵列采用圆形悬浮板结构,并在膜顶采用可变质量负载,以建立相同的单元尺寸但不同的谐振频率,最终实现宽带宽、提高灵敏度和增强填充因子。我们研究了四种具有不同质量负载的 PMUT 阵列(20 个单元乘以 25 个单元),并将其与传统的钳位边界阵列进行了比较。在每种设计中,一个元素(25 个单元)中集成了 13 种不同直径质量负载的单元,因此具有显著的大 BW。该设计采用等尺寸单元的 PMUT,与目前采用多尺寸单元的宽带 PMUT 相比,提高了填充因子。制作出的原型器件显示,与传统器件相比,膜体积位移提高了 1.7 倍,超声脉冲回波灵敏度提高了 1.5 倍,BW 提高了 5.2 倍,从 17% 提高到 89% @ 5.5 MHz 中心频率。这种创新设计为高灵敏度和宽带 PMUT 阵列提供了一种有前途的解决方案,有利于高质量超声成像。[2024-0055]
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Equidimensional Piezoelectric Micromachined Ultrasonic Transducer Array With Synchronously Improved Bandwidth and Sensitivity
Common methods to enhance PMUT arrays’ Bandwidth (BW) may compromise the sensitivity and fill factor. This study introduces a novel PMUT array with circular suspended plate structure and variable mass load atop the membranes to establish identical cell size but different resonant frequencies, and finally achieves a broad BW, improved sensitivity and augmented fill factor. Four such kinds PMUT arrays (20 element $\times 25$ cells) with different mass loads are studied and compared to traditional one with clamped boundary. In each design, 13 variations of cells equipped with varying-diameter mass load are integrated in one element (25 cells), resulting in a notable large BW. This design features PMUTs with an equidimensional cell size, leading a heightened filling factor compared to current wideband PMUTs with multi-size cells. Prototyped devices are fabricated and show a 1.7X improvement in membrane volume displacement, 1.5X higher ultrasound pulse-echo sensitivity and 5.2X increase in BW, from 17% to 89% @ 5.5 MHz center frequency, comparing to the traditional one. This innovative design suggests a promising solution for high sensitivity and wideband PMUT arrays, benefiting high-quality ultrasound imaging. [2024-0055]
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
期刊最新文献
Table of Contents Front Cover Journal of Microelectromechanical Systems Publication Information Corrections to “Parallel In-Plane Electrothermal Actuators” 2024 Index Journal of Microelectromechanical Systems Vol. 33
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