设计新型含硅炔基二胺及其相关热固性聚酰亚胺树脂

IF 1.8 4区 化学 Q3 POLYMER SCIENCE High Performance Polymers Pub Date : 2024-07-25 DOI:10.1177/09540083241266225
Yumeng Liu, Xiwei Liu, Jiyu Xia, Yitian Wang, Jianke Hu, Yanhong Hu
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引用次数: 0

摘要

为了改善聚酰亚胺树脂的加工性和热性能,本文设计并合成了一种引入硅和炔基的新型二胺单体双(对氨基苯乙炔基)二甲基硅烷。并以 4,4′-氧代双(邻苯二甲酸酐)(ODPA)为二酐单体,与该二胺单体一起制备了一种主链上具有硅和炔基结构的新型热固性聚酰亚胺树脂 SiOPI。二胺单体和聚酰亚胺的结构分别通过氢核磁共振谱(1H NMR)、傅立叶变换红外光谱(FT-IR)、质谱(MS)和 X 射线衍射(XRD)进行了表征。在 PI 中加入硅基可增加树脂的柔韧性,并提供良好的溶解性和加工性。SiOPI 可很好地溶于 DMF、DMSO 和 THF。该树脂在 50-88°C 温度下的粘度小于 200 Pa-s,具有广泛的加工性。由于引入了炔基,固化后的聚酰亚胺形成了类似于苯环的致密网状结构,从而使树脂具有优异的耐热性和机械性能。SiOPI 的玻璃化温度(Tg)达到 367°C,5% 时的热损失温度(Td5)为 540.9°C,10% 时的热损失温度(Td10)为 592.2°C,800°C 时的残碳率(R800°C)在氮气环境下为 65.76%。c-SiOPI 的拉伸强度在室温下为 257.6 兆帕,在 300°C 时为 232.9 兆帕,残碳率为 90.41%。
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Design of novel silicon-containing alkynyl diamines and their related thermosetting polyimide resins
In order to improve the PI resin’s processability and thermal properties, a novel diamine monomer bis(p-aminophenylethynyl)dimethylsilane was designed and synthesized by introducing silicon and alkyne groups in this paper. And a new thermosetting polyimide resin SiOPI with silicon and alkynyl structures in the main chain was prepared using 4,4′-oxobis (phthalic anhydride) (ODPA) as the dianhydride monomer with this diamine monomer. The structures of the diamine monomer and the polyimide were characterized by H nuclear magnetic resonance spectroscopy (1H NMR), Fourier transform infrared spectroscopy (FT-IR), mass spectrometry (MS), and X-ray diffraction (XRD), respectively. The incorporation of silyl groups into the PI increases the flexibility of the resin and provides good solubility and processability. The SiOPI is well soluble in DMF, DMSO and THF. The resin has a viscosity of less than 200 Pa·s at 50–88°C and has a wide processability range. By virtue of the introduction of alkyne groups, the cured polyimide forms dense reticulated structures, analogous to the benzene ring, giving the resin excellent heat resistance and mechanical property. The glass transition temperature (Tg) of SiOPI reached 367°C, and the heat loss temperature at 5% (Td5) is 540.9°C, the heat loss temperature at 10% (Td10) is 592.2°C, and the residual carbon rate at 800°C (R800°C) is 65.76% in a nitrogen atmosphere. The tensile strength of c-SiOPI is 257.6 MPa at room temperature and 232.9 MPa with a retention rate of 90.41% at 300°C, respectively.
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来源期刊
High Performance Polymers
High Performance Polymers 化学-高分子科学
CiteScore
4.20
自引率
14.30%
发文量
106
审稿时长
1.2 months
期刊介绍: Health Services Management Research (HSMR) is an authoritative international peer-reviewed journal which publishes theoretically and empirically rigorous research on questions of enduring interest to health-care organizations and systems throughout the world. Examining the real issues confronting health services management, it provides an independent view and cutting edge evidence-based research to guide policy-making and management decision-making. HSMR aims to be a forum serving an international community of academics and researchers on the one hand and healthcare managers, executives, policymakers and clinicians and all health professionals on the other. HSMR wants to make a substantial contribution to both research and managerial practice, with particular emphasis placed on publishing studies which offer actionable findings and on promoting knowledge mobilisation toward theoretical advances. All papers are expected to be of interest and relevance to an international audience. HSMR aims at enhance communication between academics and practitioners concerned with developing, implementing, and analysing health management issues, reforms and innovations primarily in European health systems and in all countries with developed health systems. Papers can report research undertaken in a single country, but they need to locate and explain their findings in an international context, and in international literature.
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