带涂层导体胶带中临界电流降低位置的电流和传热分析

F. Gomory, J. Šouc
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摘要

临界电流沿导体长度的变化是工业生产的 REBCO 磁带(称为涂层导体 (CC))中常见的特征。从制造商提供的卷对卷表征数据中可以观察到,在几毫米长的部分,临界电流的减小超过了百分之几。CC 结构中的金属层可以分担此类 "薄弱点 "的部分电流,并有助于保持局部温度稳定,防止其热失控并转化为 "热点"。由于空间和重量的限制,无法添加厚度足以匹配超导体传输能力损失的金属层时,理解这一现象就显得尤为重要。为此,我们研究了一组样品,它们代表了在直接传输实验中发现的薄弱点的标准剖面和非频繁剖面。然后利用分析理论作为恢复特性的基本工具,作为数值建模的输入。研究发现了薄弱点位置的温度曲线和电流再分布,并分析了冷却条件和金属层厚度对薄弱点抗热失控的影响。通过添加铜稳定层或改进冷却设置,对提高 CC 磁带性能的可能性进行定量评估,有助于优化用于电动交通的涂层导体结构。
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Analysis of current and heat transfer in location with reduced critical current in coated conductor tape
Variation of critical current along the conductor length is the feature commonly encountered in industrially produced REBCO tapes called coated conductors (CC). Reduction of critical current exceeding several percent in the portions few millimetres long can be observed in the data obtained by reel-to-reel characterisation provided by manufacturers. Metallic layers in the CC architecture can take over some current in such „weak spot”, and help to keep the local temperature stable, preventing its thermal runaway and conversion to a “hot spot”. Understanding the phenomenon is particularly crucial when the space and weight limitations do not allow to add metallic layer with the thickness, that would be sufficient to match the lost transport capability of superconductor. For this purpose, we studied a set of samples, representing both standard as well as infrequent profiles of weak spots identified in direct transport experiments. Analytical theory was then utilised as basic tool for recovering the properties serving as input for numerical modelling. Temperature profiles and current redistribution in the weak spot locations were found, and the effect of cooling conditions and metallic layer thickness on the weak spot resistance against thermal runaway analysed. Quantitative assessment of the possibility to improve the performance of CC tape by adding Cu stabilising layer or improving cooling settings could help to optimise the architecture of coated conductor intended for use in electric transport.
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