基于物理的 CNT 薄膜晶体管紧凑型综合模型--第二部分:欧姆接触

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-07-30 DOI:10.1109/TED.2024.3421179
Srijeet Tripathy;Ambika Kumari;Tarun Kanti Bhattacharyya
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引用次数: 0

摘要

作为前一篇文章的延续,这一部分介绍了欧姆接触碳纳米管薄膜晶体管(CNT TFT)中的电气传输研究。在这里,晶体管模型是作为之前介绍的广义模型的一个特例来实现的。根据模拟数据和实验数据之间的比较,可以发现欧姆接触式 CNT TFT 中的光学声子散射与肖特基接触式 TFT 相比,与栅极和漏极偏置相当独立。此外,研究还发现,传输受到通道长度和 CNT 之间排列的显著影响,因为通道长度越小、排列越整齐,光声子散射越明显。模拟结果与大量实验数据之间的良好一致性证明了该模型的成功。通过计算相对均方根误差 (RMSE),可以验证这一点。与之前的 CNT TFT 模型相比,这项工作引入了一个通用模型,同时考虑了肖特基和欧姆接触诱导的常极性和单极性传输模式,密切遵循了基本的传输物理学原理。
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A Comprehensive Physics-Based Compact Model for CNT Thin Film Transistors—Part II: Ohmic Contact
In continuation to the preceding article, this part presents a study of electrical transport in Ohmic contact carbon nanotube thin film transistors (CNT TFTs). Here, the transistor model is implemented as a special case of the previously presented generalized model. Based on comparisons between simulated and experimental data, it is observed that optical phonon scattering in Ohmic contact CNT TFTs is fairly independent of gate and drain biases as opposed to the Schottky contact counterparts. Moreover, it is observed that transport is significantly affected by the channel length and alignment between CNTs as optical phonon scattering is found to be more pronounced for smaller channel lengths and greater alignments. The success of the model is supported by good agreement between simulations and a wide range of experimental data. This is verified by calculating the relative root mean square error (RMSE) which shows an average deviation in the order of ~15%. In comparison to previous CNT TFT models, this work introduces a generalized model, considering both Schottky and Ohmic contact-induced ambipolar and unipolar modes of transport, closely following the essential transport physics.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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