{"title":"使用 DG-InAlN/GaN HEMT 提升射频性能","authors":"Vandana Kumari;Manoj Saxena;Mridula Gupta","doi":"10.1109/TED.2024.3430251","DOIUrl":null,"url":null,"abstract":"The work presented in this study examines the behavior of InAlN/GaN high electron mobility transistor (HEMT) by scaling down the device geometry, including the gate length and barrier thickness, at various operating temperatures. Extensive simulation has been performed using Silvaco’s Victory TCAD simulator tool to analyze the dc and RF performance of InAlN HEMT in terms of \n<inline-formula> <tex-math>${I}_{\\text {on}}/{I}_{\\text {off}}$ </tex-math></inline-formula>\n, intrinsic gain, DIBL, and cutoff frequency. To strengthen the RF performance at increased device length, dual gate (DG) architecture [i.e., Gate 1 (G1) and Gate 2 (G2)] has been adopted, and different gate biasing combinations have been used to investigate the device performance. A tradeoff among intrinsic gain and cutoff frequency is noted from the results. An increment in the cutoff frequency of nearly 57% has been obtained with the introduction of DG along with a deterioration in intrinsic gain.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":null,"pages":null},"PeriodicalIF":2.9000,"publicationDate":"2024-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"RF Performance Augmentation Using DG-InAlN/GaN HEMT\",\"authors\":\"Vandana Kumari;Manoj Saxena;Mridula Gupta\",\"doi\":\"10.1109/TED.2024.3430251\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The work presented in this study examines the behavior of InAlN/GaN high electron mobility transistor (HEMT) by scaling down the device geometry, including the gate length and barrier thickness, at various operating temperatures. Extensive simulation has been performed using Silvaco’s Victory TCAD simulator tool to analyze the dc and RF performance of InAlN HEMT in terms of \\n<inline-formula> <tex-math>${I}_{\\\\text {on}}/{I}_{\\\\text {off}}$ </tex-math></inline-formula>\\n, intrinsic gain, DIBL, and cutoff frequency. To strengthen the RF performance at increased device length, dual gate (DG) architecture [i.e., Gate 1 (G1) and Gate 2 (G2)] has been adopted, and different gate biasing combinations have been used to investigate the device performance. A tradeoff among intrinsic gain and cutoff frequency is noted from the results. An increment in the cutoff frequency of nearly 57% has been obtained with the introduction of DG along with a deterioration in intrinsic gain.\",\"PeriodicalId\":13092,\"journal\":{\"name\":\"IEEE Transactions on Electron Devices\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2024-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electron Devices\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10620300/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10620300/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
RF Performance Augmentation Using DG-InAlN/GaN HEMT
The work presented in this study examines the behavior of InAlN/GaN high electron mobility transistor (HEMT) by scaling down the device geometry, including the gate length and barrier thickness, at various operating temperatures. Extensive simulation has been performed using Silvaco’s Victory TCAD simulator tool to analyze the dc and RF performance of InAlN HEMT in terms of
${I}_{\text {on}}/{I}_{\text {off}}$
, intrinsic gain, DIBL, and cutoff frequency. To strengthen the RF performance at increased device length, dual gate (DG) architecture [i.e., Gate 1 (G1) and Gate 2 (G2)] has been adopted, and different gate biasing combinations have been used to investigate the device performance. A tradeoff among intrinsic gain and cutoff frequency is noted from the results. An increment in the cutoff frequency of nearly 57% has been obtained with the introduction of DG along with a deterioration in intrinsic gain.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.