中波红外小间距碲化镉汞探测器的结形成处理

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electron Devices Pub Date : 2024-08-01 DOI:10.1109/TED.2024.3433313
Yu Zhao;Zhikai Gan;Chun Lin;Quanzhi Sun;Liqi Zhu;Songmin Zhou;Xi Wang;Xun Li
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引用次数: 0

摘要

小间距碲化镉汞探测器是红外成像技术的一个发展趋势。它需要具有小像素的焦平面阵列。研究了 HgCdTe 结形成过程中的注入剂量和汞空位浓度等关键因素。采用特殊设计的结间距实验直接测量结膨胀。通过数值方法模拟结膨胀,解释了碲化镉汞结膨胀的物理机制。此外,还利用结点间距实验和模拟得到的建议参数进行了像素阵列测试。这验证了实验和数值模型的正确性和有效性。这项研究给出了碲化镉汞结形成的基本概念,显示了制造小间距探测器的适当参数,并提供了用于模拟和优化碲化镉汞结设计的数值模型。
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Junction Formation Processing of MWIR Small-Pitch HgCdTe Detectors
Small-pitch HgCdTe detector is a strong trend in IR imaging. It requires focal plane arrays with small pixels. The key factors including injection dose and Hg vacancy concentration during HgCdTe junction formation were studied. A special designed junction spacing experiment was used to directly measure the junction expansion. The simulation of junction expansion through numerical method was carried out to interpret the physical mechanism of junction expansion in HgCdTe. Moreover, a pixel array test using the suggested parameters obtained in junction spacing experiment and simulation was also carried out. It validates the correctness and effectiveness of the experiment and the numerical model. This work gives fundamental concept of junction formation in HgCdTe, shows the proper parameters for fabricating the small-pitch detectors, and provides numerical model for simulation and optimization of HgCdTe junction design.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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