通过机械联锁实现高度坚固的软硬连接,用于组装超拉伸显示器

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC npj Flexible Electronics Pub Date : 2024-08-08 DOI:10.1038/s41528-024-00337-9
Lixue Tang, Huayi Wang, Jifeng Ren, Xingyu Jiang
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引用次数: 0

摘要

可拉伸电子电路能以高集成度无缝贴合不规则的动态表面。然而,目前的可拉伸配置通常具有有限的可拉伸性,这是因为软互连器件和刚性电子器件之间缺乏稳健的连接。在这里,我们在热塑性弹性体上打印了高度可拉伸的金属聚合物导体作为互连器件。我们为刚性电子元件开发了具有多孔表面的电子背心,并引入了聚酯热熔胶来加强软互连器件与刚性电子元件之间的连接。热粘合后,粘合剂渗入电子背心的多孔表面,形成机械互锁,为连接提供 8.34 牛/厘米的粘合力(比导电粘合剂高 3 倍)。因此,不同尺寸和不同引脚数的刚性电子元件可以与软互连器件形成牢固的连接,最大应变容限可达 ~700%(比导电粘合剂高 10 倍)。我们实现了高度集成的超拉伸显示器,可承受高达 220% 的拉伸而不会出现像素死角。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Highly robust soft-rigid connections via mechanical interlocking for assembling ultra-stretchable displays
Stretchable electronic circuits can seamlessly conform to irregular and dynamic surfaces with high integration. However, current stretchable configurations typically have limited stretchability due to the lack of robust connections between soft interconnects and rigid electronics. Here, we printed highly stretchable metal–polymer conductors on thermoplastic elastomers as interconnects. We developed electronic vests with porous surfaces for rigid electronics and introduced polyester hot-melt adhesives to strengthen connections between soft interconnects and rigid electronics. After thermal bonding, the adhesive penetrates the porous surface of electronic vests, creating a mechanical interlock and providing an adhesion force of 8.34 N/cm for the connection (3× higher than conductive adhesives). Thus, rigid electronics of different sizes and different pin counts can form strong connections to soft interconnects, achieving a maximum strain tolerance of ~700% (10× higher than conductive adhesives). We achieved highly integrated ultra-stretchable displays that can withstand stretching up to 220% without dead pixels.
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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