{"title":"高热流密度下金刚石微通道散热性能的数值研究","authors":"Jiwen Zhao, Kunlong Zhao, Xiaobin Hao, Yicun Li, Sen Zhang, Benjian Liu, Bing Dai, Wenxin Cao, Jiaqi Zhu","doi":"10.3390/pr12081675","DOIUrl":null,"url":null,"abstract":"Heat dissipation significantly limits semiconductor component performance improvement. Thermal management devices are pivotal for electronic chip heat dissipation, with the enhanced thermal conductivity of materials being crucial for their effectiveness. This study focuses on single-crystal diamond, renowned for its exceptional natural thermal conductivity, investigating diamond microchannels using finite element simulations. Initially, a validated mathematical model for microchannel flow heat transfer was established. Subsequently, the heat dissipation performance of typical microchannel materials was analyzed, highlighting the diamond’s impact. This study also explores diamond microchannel topologies under high-power conditions, revealing unmatched advantages in ultra-high heat flux density dissipation. At 800 W/cm2 and inlet flow rates of 0.4–1 m/s, diamond microchannels exhibit lower maximum temperatures compared to pure copper microchannels by 7.0, 7.2, 7.4, and 7.5 °C, respectively. Rectangular cross-section microchannels demonstrate superior heat dissipation, considering diamond processing costs. The exploration of angular structures with varying parameters shows significant temperature reductions with increasing complexity, such as a 2.4 °C drop at i = 4. The analysis of shape parameter ki indicates optimal heat dissipation performance at ki = 1.1. 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引用次数: 0
摘要
散热极大地限制了半导体元件性能的提高。热管理装置对于电子芯片散热至关重要,而增强材料的导热性则是其有效性的关键。本研究以天然导热性能优异的单晶金刚石为研究对象,通过有限元模拟研究金刚石微通道。首先,建立了一个经过验证的微通道流动传热数学模型。随后,分析了典型微通道材料的散热性能,突出了金刚石的影响。这项研究还探讨了高功率条件下的金刚石微通道拓扑结构,揭示了其在超高热流密度散热方面无与伦比的优势。在 800 W/cm2 和 0.4-1 m/s 的入口流速条件下,金刚石微通道的最高温度分别比纯铜微通道低 7.0、7.2、7.4 和 7.5 °C。考虑到金刚石的加工成本,矩形截面微通道具有更优越的散热性能。对不同参数的角度结构的研究表明,随着复杂程度的增加,温度显著降低,例如 i = 4 时温度降低了 2.4 °C。对形状参数 ki 的分析表明,ki = 1.1 时散热性能最佳。这项研究为开发和优化超高热流密度条件下的金刚石微通道器件提供了重要启示,为热管理技术的未来发展提供了指导。
Numerical Study on the Heat Dissipation Performance of Diamond Microchannels under High Heat Flux Density
Heat dissipation significantly limits semiconductor component performance improvement. Thermal management devices are pivotal for electronic chip heat dissipation, with the enhanced thermal conductivity of materials being crucial for their effectiveness. This study focuses on single-crystal diamond, renowned for its exceptional natural thermal conductivity, investigating diamond microchannels using finite element simulations. Initially, a validated mathematical model for microchannel flow heat transfer was established. Subsequently, the heat dissipation performance of typical microchannel materials was analyzed, highlighting the diamond’s impact. This study also explores diamond microchannel topologies under high-power conditions, revealing unmatched advantages in ultra-high heat flux density dissipation. At 800 W/cm2 and inlet flow rates of 0.4–1 m/s, diamond microchannels exhibit lower maximum temperatures compared to pure copper microchannels by 7.0, 7.2, 7.4, and 7.5 °C, respectively. Rectangular cross-section microchannels demonstrate superior heat dissipation, considering diamond processing costs. The exploration of angular structures with varying parameters shows significant temperature reductions with increasing complexity, such as a 2.4 °C drop at i = 4. The analysis of shape parameter ki indicates optimal heat dissipation performance at ki = 1.1. This research offers crucial insights for developing and optimizing diamond microchannel devices under ultra-high-heat-flux-density conditions, guiding future advancements in thermal management technology.
期刊介绍:
Processes (ISSN 2227-9717) provides an advanced forum for process related research in chemistry, biology and allied engineering fields. The journal publishes regular research papers, communications, letters, short notes and reviews. Our aim is to encourage researchers to publish their experimental, theoretical and computational results in as much detail as necessary. There is no restriction on paper length or number of figures and tables.