{"title":"阈值决策定向下降 (T3D):DDR5 DRAM DFE 的调整解决方案","authors":"Mitchell Cooke;Nicola Nicolici","doi":"10.1109/TVLSI.2024.3435419","DOIUrl":null,"url":null,"abstract":"Emerging memory technologies, such as DDR5, offer increased data rates and storage capacities, at the expense of signal integrity challenges. To address these challenges, the DDR5 standard incorporates a four-tap decision feedback equalizer (DFE). As elaborated in this article, known methods for DFE tuning are limited due to interface complexity and distinct equalization requirements for DDR5. We propose a decision-directed DFE tuning method called thresholding decision-directed descent (T3D). By leveraging DDR5 architectural features, our novel method tracks the eye envelope as it opens, which facilitates rapid convergence compared to the state of the art. To validate the performance of T3D, silicon measurements are presented alongside a virtual testbench methodology. By demonstrating the high correlation between silicon and simulation results, the virtual testbench can be beneficial for the design, validation, and prototyping of future DFE tuning methods.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"32 11","pages":"2060-2073"},"PeriodicalIF":2.8000,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thresholding Decision-Directed Descent (T3D): A Tuning Solution for DDR5 DRAM DFEs\",\"authors\":\"Mitchell Cooke;Nicola Nicolici\",\"doi\":\"10.1109/TVLSI.2024.3435419\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Emerging memory technologies, such as DDR5, offer increased data rates and storage capacities, at the expense of signal integrity challenges. To address these challenges, the DDR5 standard incorporates a four-tap decision feedback equalizer (DFE). As elaborated in this article, known methods for DFE tuning are limited due to interface complexity and distinct equalization requirements for DDR5. We propose a decision-directed DFE tuning method called thresholding decision-directed descent (T3D). By leveraging DDR5 architectural features, our novel method tracks the eye envelope as it opens, which facilitates rapid convergence compared to the state of the art. To validate the performance of T3D, silicon measurements are presented alongside a virtual testbench methodology. By demonstrating the high correlation between silicon and simulation results, the virtual testbench can be beneficial for the design, validation, and prototyping of future DFE tuning methods.\",\"PeriodicalId\":13425,\"journal\":{\"name\":\"IEEE Transactions on Very Large Scale Integration (VLSI) Systems\",\"volume\":\"32 11\",\"pages\":\"2060-2073\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2024-08-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Very Large Scale Integration (VLSI) Systems\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10628018/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10628018/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
Thresholding Decision-Directed Descent (T3D): A Tuning Solution for DDR5 DRAM DFEs
Emerging memory technologies, such as DDR5, offer increased data rates and storage capacities, at the expense of signal integrity challenges. To address these challenges, the DDR5 standard incorporates a four-tap decision feedback equalizer (DFE). As elaborated in this article, known methods for DFE tuning are limited due to interface complexity and distinct equalization requirements for DDR5. We propose a decision-directed DFE tuning method called thresholding decision-directed descent (T3D). By leveraging DDR5 architectural features, our novel method tracks the eye envelope as it opens, which facilitates rapid convergence compared to the state of the art. To validate the performance of T3D, silicon measurements are presented alongside a virtual testbench methodology. By demonstrating the high correlation between silicon and simulation results, the virtual testbench can be beneficial for the design, validation, and prototyping of future DFE tuning methods.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.