基于 Chiplet 的设计环境中支持更高速 BISG 和老化传感的低抖动倍频电路

IF 2.8 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE IEEE Transactions on Very Large Scale Integration (VLSI) Systems Pub Date : 2024-08-05 DOI:10.1109/TVLSI.2024.3435059
Ko-Hong Lin;Ont-Derh Lin;Shi-Yu Huang;Duo Sheng
{"title":"基于 Chiplet 的设计环境中支持更高速 BISG 和老化传感的低抖动倍频电路","authors":"Ko-Hong Lin;Ont-Derh Lin;Shi-Yu Huang;Duo Sheng","doi":"10.1109/TVLSI.2024.3435059","DOIUrl":null,"url":null,"abstract":"Built-in speed grading (BISG) is a technique that measures the maximum operating speed (\n<inline-formula> <tex-math>$F_{\\max }$ </tex-math></inline-formula>\n) of a circuit under grading (CUG) in silicon. Recently, it has been reported as an effective aging sensor as well. In nowadays-chiplet-based design, the BISG circuit and the CUG could use different process technologies. In general, the BISG circuit needs to produce a clock signal with a frequency matching the \n<inline-formula> <tex-math>$F_{\\max }$ </tex-math></inline-formula>\n of the CUG. In this article, we discuss how to leverage an existing flexible wide-range cell-based phased-locked loop (PLL) with a frequency doubling circuit (FDC) to support even higher \n<inline-formula> <tex-math>$F_{\\max }$ </tex-math></inline-formula>\n for a CUG that may use a more advanced technology in another die. As demonstrated in a 90 nm process, a PLL supporting a frequency range of [40 MHz, 1.25 GHz] using a mature 90 nm CMOS process can now support up to 2 GHz.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"32 12","pages":"2210-2219"},"PeriodicalIF":2.8000,"publicationDate":"2024-08-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Low-Jitter Frequency Doubling Circuit Supporting Higher-Speed BISG and Aging Sensing in a Chiplet-Based Design Environment\",\"authors\":\"Ko-Hong Lin;Ont-Derh Lin;Shi-Yu Huang;Duo Sheng\",\"doi\":\"10.1109/TVLSI.2024.3435059\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Built-in speed grading (BISG) is a technique that measures the maximum operating speed (\\n<inline-formula> <tex-math>$F_{\\\\max }$ </tex-math></inline-formula>\\n) of a circuit under grading (CUG) in silicon. Recently, it has been reported as an effective aging sensor as well. In nowadays-chiplet-based design, the BISG circuit and the CUG could use different process technologies. In general, the BISG circuit needs to produce a clock signal with a frequency matching the \\n<inline-formula> <tex-math>$F_{\\\\max }$ </tex-math></inline-formula>\\n of the CUG. In this article, we discuss how to leverage an existing flexible wide-range cell-based phased-locked loop (PLL) with a frequency doubling circuit (FDC) to support even higher \\n<inline-formula> <tex-math>$F_{\\\\max }$ </tex-math></inline-formula>\\n for a CUG that may use a more advanced technology in another die. As demonstrated in a 90 nm process, a PLL supporting a frequency range of [40 MHz, 1.25 GHz] using a mature 90 nm CMOS process can now support up to 2 GHz.\",\"PeriodicalId\":13425,\"journal\":{\"name\":\"IEEE Transactions on Very Large Scale Integration (VLSI) Systems\",\"volume\":\"32 12\",\"pages\":\"2210-2219\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2024-08-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Very Large Scale Integration (VLSI) Systems\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10623439/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10623439/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0

摘要

内置速度分级(BISG)是一种测量在硅中分级(CUG)下电路的最大工作速度($F_{\max}$)的技术。最近,它也被报道为一种有效的老化传感器。在现在基于芯片的设计中,BISG电路和CUG可以采用不同的工艺技术。一般来说,BISG电路需要产生频率与CUG的$F_{\max}$匹配的时钟信号。在本文中,我们讨论了如何利用现有的灵活的宽范围基于单元的锁相环(PLL)和倍频电路(FDC)来支持更高的F_{\max}$,以便在另一个芯片中使用更先进的技术。正如90纳米工艺所展示的那样,使用成熟的90纳米CMOS工艺支持[40 MHz, 1.25 GHz]频率范围的锁相环现在可以支持高达2 GHz的频率。
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Low-Jitter Frequency Doubling Circuit Supporting Higher-Speed BISG and Aging Sensing in a Chiplet-Based Design Environment
Built-in speed grading (BISG) is a technique that measures the maximum operating speed ( $F_{\max }$ ) of a circuit under grading (CUG) in silicon. Recently, it has been reported as an effective aging sensor as well. In nowadays-chiplet-based design, the BISG circuit and the CUG could use different process technologies. In general, the BISG circuit needs to produce a clock signal with a frequency matching the $F_{\max }$ of the CUG. In this article, we discuss how to leverage an existing flexible wide-range cell-based phased-locked loop (PLL) with a frequency doubling circuit (FDC) to support even higher $F_{\max }$ for a CUG that may use a more advanced technology in another die. As demonstrated in a 90 nm process, a PLL supporting a frequency range of [40 MHz, 1.25 GHz] using a mature 90 nm CMOS process can now support up to 2 GHz.
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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Table of Contents IEEE Transactions on Very Large Scale Integration (VLSI) Systems Society Information IEEE Transactions on Very Large Scale Integration (VLSI) Systems Publication Information Table of Contents IEEE Transactions on Very Large Scale Integration (VLSI) Systems Society Information
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